Relationship between coefficient of friction and surface roughness of wafer in nano machining process

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原文链接

NETL
Spie-Int Soc Optical Engineering

外文摘要：Fixed abrasive polishing technology can obtain a nanoscale surface and is one of the future nano machining directions。 The coefficient of friction between the pad and the wafer in the polishing process can influence on the surface quality of the wafer。 The relationship between the coefficient of friction and surface roughness of the wafer was investigated to improve the efficiency and surface quality。 Based on the Florida model， the adhesion， asperity plough and abrasive plough from the pad in the polishing process was analyzed。 The friction force per unit area was calculated by the properties of the pad and wafer。 Based on the rod model， the actual contact area was calculated by the surface roughness and the properties of the pad and wafer。 The relational model between the surface roughness of the wafer and the friction coefficient was established。 The model was verified by the experiments of fixed abrasive polishing of BK7 glass。 When the friction coefficient is less than 1。9， the data of the experiment and theory match very well in the comparison process。

外文关键词：

Nano machiningFixed abrasive polishingCoefficient of frictionSurface roughnessModel

作者：

Li Jun、Xia Lei、Li Pengpeng、Zhu Yongwei、Sun Yuli、Zuo Dunwen

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作者单位：

Jiangsu Key Laboratory of Precision and Micro-Manufacturing Technology, College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, 29 Yudao Street, Nanjing, 210016, P. R. China

会议名称：

International conference on smart materials and nanotechnology in engineering

会议地点：

Gold Coast(AU)

会议母体文献：

Fourth international conference on smart materials and nanotechnology in engineering

页码：

87931Y.1-87931Y.6

出版时间：

2013

DOI：

10.1117/12.2027965