Preparation and Properties of Cross-linked/Composite Modified Polyimide Films
The polyimide thin films with low dielectric properties based on fluorinated monomers were synthesized and prepared,the thin films properties was further modified with mesoporous silica. The heat resistance,mechanical and dielectric properties of the thin films can be essentially understood on the basis of the effect of the addition of mesoporous silica fillers. In order to maintain the processability of the thin films,the cross-linked structure was used to enhance the mechanical properties and thermal stability of the films. The results indicated that the addition of mesoporous silica can significantly reduce the dielectric constant and dielectric loss,but may have adverse effects on the mechanical properties of the thin films. Introducing cross-linked structures can further enhance the mechanical properties and thermal stability of the thin films. By simultaneously introducing mesoporous silica and cross-linked structure,the dielectric properties,mechanical properties,and thermal stability of the thin films can be improved synchronously.
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