硅基板的网格化地平面设计优化
Optimization of Meshed Ground Plane Design for Silicon Substrate
杨巧 1李康荣 1王艳玲1
作者信息
摘要
基于工艺要求,结合三维全波电磁仿真和网格化地平面等效结构建模,对硅基板中网格化地平面上微带线的特征阻抗和传输特性进行仿真分析.对比了两种不同网格地优化方法的设计思路,并对网格化地平面的传输线特征阻抗差异进行分析.提出了一种可准确快速给出传输线特征阻抗并进行网格化地平面设计优化的方法.
Abstract
The characteristic impedance and transmission characteristics of microstrip lines on the meshed ground plane in silicon substrate are simulated based on the technological requirements,combined with three-dimensional full-wave electromagnetic simulation and meshed ground plane equivalent modeling.Two different meshed ground optimization methods are compared,and the difference of transmission line characteristic impedance on meshed ground plane is analyzed.A method for accurately and quickly providing the characteristic impedance of transmission lines and optimizing meshed ground plane design has been proposed.
关键词
硅基板/网格化地平面/特征阻抗/反射损耗Key words
silicon substrate/meshed ground plane/characteristic impedance/return loss引用本文复制引用
出版年
2025
NETL
NSTL
万方数据