Optimization of Meshed Ground Plane Design for Silicon Substrate
The characteristic impedance and transmission characteristics of microstrip lines on the meshed ground plane in silicon substrate are simulated based on the technological requirements,combined with three-dimensional full-wave electromagnetic simulation and meshed ground plane equivalent modeling.Two different meshed ground optimization methods are compared,and the difference of transmission line characteristic impedance on meshed ground plane is analyzed.A method for accurately and quickly providing the characteristic impedance of transmission lines and optimizing meshed ground plane design has been proposed.
silicon substratemeshed ground planecharacteristic impedancereturn loss
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