含氟芳香族低介电损耗PI薄膜的制备与性能
Fluorinated aromatic PI films:preparation,low dielectric loss and other properties
王新明 1李鹤鸣 1丁梓洋 1高伟国 1刘岩 1胡知之 2马可1
作者信息
- 1. 辽宁科技大学 化学工程学院,辽宁 鞍山 114051
- 2. 辽宁科技大学 化学工程学院,辽宁 鞍山 114051;辽宁奥克华辉新材料有限公司,辽宁 辽阳 111003
- 折叠
摘要
聚酰亚胺(PI)薄膜在5G通信场景中具有广阔的使用前景,但5G天线基材对于PI薄膜在高频电场下的介电损耗等性能有十分苛刻的要求.本文制备了含氟共聚PI薄膜,并对其在高频下影响介电性能的部分因素进行探索.采用红外、紫外、热重分析、差示扫描量热等多种测试方法对不同共聚比例PI薄膜样品的热性能、热稳定性和光透过性等进行研究.结果表明,PI薄膜的最高透光率都在90%以上;PI-AD系列PI薄膜最大拉伸强度为112.68 MPa,拉伸模量为3.22 GPa;PI-AE系列PI薄膜的最大拉伸强度为119.32 MPa,拉伸模量为3.52 GPa.PI薄膜受热分解的温度均达到500℃以上,玻璃化转变温度达到270℃以上;含氟共聚PI薄膜在电场为10 GHz的条件下,介电常数都低于3,最低介电损耗为0.004 12.
Abstract
Polyimide(PI)thin films have broad application prospects in 5G communication scenarios,but 5G antenna substrates have very strict requirements for the dielectric loss performance of PI thin films under high-frequency electric fields.Focusing on this topic,this study prepared fluorinated copolymer polyimide films and explored some influencing factors on the low dielectric loss performance of PI films at high frequencies.The thermal properties,thermal stability,and light transmittance of thin film samples with different propor-tions were studied using various testing methods such as infrared,ultraviolet,thermogravimetric analysis,and differential scanning calorimetry.The results show that the highest transmittance of PI films is above 90%;The maximum tensile strength of PI AD series PI films is 112.68 MPa,and the tensile modulus is 3.22 GPa;The maximum tensile strength of PI AE series PI films is 119.32 MPa,and the tensile modulus is 3.52 GPa;The temperature of PI films start thermal weight loss above 500℃,and the glass transition temperature reaches above 270℃;Under the condition of an electric field of 10 GHz,the dielectric constants of fluorinated copoly-mer PI films are all below 3,and the minimum dielectric loss is 0.00412.
关键词
聚酰亚胺薄膜/含氟/芳香族/介电损耗Key words
PI film/fluorine content/aromatic group/dielectric loss引用本文复制引用
基金项目
辽宁省教育厅项目(LJKMZ20220660)
辽宁科技大学校基金(2020QN05)
辽宁科技大学校人才启动项目(6003000322)
出版年
2024
NETL
NSTL
万方数据