Thermal Simulation and Analysis of Quantum Cascade Laser
Two-dimensional heat-dissipation models of common devices were established using the finite element method to improve the heat-dissipation capacity of quantum-cascade lasers(QCLs).By setting the heatsink temperature to 293 K,wavelength to 8.3 μm,waveguide width to 8 μm,and thermal power to 12.4 W,the temperature,heat flux distribution,and heat dissipation capabilities of QCLs with different device structures were studied.The results show that the highest temperatures of the epilayer-up-bonded double-channel ridge device without and with electroplated gold were 546 K and 409 K,respectively,while that of the epilayer-down-bonded device was 362 K.For buried heterostructure(BH)devices,the highest temperatures of the epilayer-up-bonded device without and with electroplated gold were 404 K and 401 K,respectively,while that of the epilayer-down-bonded device was 361 K.Compared with the copper submount,the highest temperature of the buried heterostructure epilayer-down-bonded to a diamond submount device was 355 K.Analysis of the heat flux distribution of the models shows that the heat flux of the BH devices is more uniform,and the temperature of the core area is lower,indicating that BH structures are more suitable for high-power devices.
QCLsheat dissipation modeltemperature distributionheat flux distribution
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万方数据
