半导体光电2024,Vol.45Issue(4) :561-567.DOI:10.16818/j.issn1001-5868.2024042901

基于FBG的高温压力传感器设计与校准

Design and Experimental Test of High Temperature Pressure Sensor Based on FBG

张白莉 高震森 郭红英
半导体光电2024,Vol.45Issue(4) :561-567.DOI:10.16818/j.issn1001-5868.2024042901

基于FBG的高温压力传感器设计与校准

Design and Experimental Test of High Temperature Pressure Sensor Based on FBG

张白莉 1高震森 2郭红英1
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作者信息

  • 1. 忻州师范学院电子系,山西忻州 034000
  • 2. 广东工业大学信息工程学院,广州 510006;通感融合光子技术教育部重点实验室,广州 510006
  • 折叠

摘要

针对弹药热安全检测中压力检测的需求,设计了一种基于光纤光栅的高温压力传感器.通过深入研究传感构型的弹性形变对光纤光栅输出信号波长的影响和作用机制,设计了传感器封装模型结构,并对其内部参数进行了优化设计.应用有限元建立了传感器封装结构的三维立体模型,通过对模型施加10 MPa载荷,实现了模型的受压仿真,仿真结果验证了传感器压力转换结构设计的合理性.同时以薄板小挠度变形理论为基础,计算出传感器的理论压力灵敏度,设计了传感器的温度补偿方式,进行了不同温度环境下的压力校准实验,得出了传感器在不同温度的压力灵敏度变化趋势,证明了该传感器在100~450℃环境压力测量以及温度补偿方法的有效性.

Abstract

In this paper,a kind of high temperature pressure sensor based on fiber grating (FBG) is designed to meet the demand of pressure detection. Through analysis and comparison,suitable packaging materials and grating coating layers were selected,structural parameters were designed,and a three-dimensional model of the sensor packaging structure was established by finite element method (Ansys Workbench). The simulation of the model was realized by applying load. The simulation results verify the rationality of the design of the pressure transfer structure of the sensor. At the same time,based on the small deflection deformation theory of thin plate,the pressure sensitivity of the sensor is calculated,the temperature compensation method of the sensor is designed,the pressure and temperature calibration experiments are carried out,the pressure sensitivity of the sensor at different temperatures is analyzed,and the effectiveness of the sensor pressure measurement and temperature compensation method at 100~450 ℃ is proved.

关键词

光纤光栅/高温压力传感器/结构设计/弹性膜片/温度补偿

Key words

fiber grating/high temperature pressure sensor/structure design/elastic diaphragm/temperature compensation

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基金项目

国家自然科学基金项目(62375055)

山西省高等学校教学改革创新项目(J2021573)

山西省忻州市科技局项目(20220507)

出版年

2024
半导体光电
中国电子科技集团公司第四十四研究所

半导体光电

CSTPCD北大核心
影响因子:0.362
ISSN:1001-5868
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