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Study on High-power LED Heat Dissipation Based on Printed Circuit Board

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In order to study the role of printed circuit board(PCB) in high-power LED heat dissipation, a simple model of high-power LED lamp was designed. According to this lamp model, some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents. The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB. However, PCB with low thermal resistance can be matched with smaUer volume heat sink, so it is hopeful to reduce the size, weight and cost of LED lamp.

high-power LEDprinted circuit board(PCB)substrate of heat dissipationthermal resistancejunction temperature

WANG Yiwei、ZHANG Jianxin、NIU Pingjuan、LI Jingyi

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School of Information and Communication Engineering, Tianjin Polytechnic University, Tianjin 300160, CHN

Tianjin Gongda HiYu Solid State Lighting Co, Ltd. Tianjin 300160, CHN

Special Fund Project of Science and Technology Innovation of Dongli DistrictResearch Project of Applied Basic and Front Technologies of Tianjin

2109030210JCZDJC15400

2010

半导体光子学与技术(英文版)
重庆光电技术研究所

半导体光子学与技术(英文版)

影响因子：0.04
ISSN：1007-0206
年,卷(期)：2010.16(2)
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