Thermal Simulation Analysis of Air-Cooled Semiconductor Laser Module Based on ANSYS
Air-cooled heat dissipation is a key technical problem in the wide application of high power laser.With the more and more wider application of laser hand welding and laser cleaning,it is more difficult for laser air cooling to dissipate heat.In this paper,the heat pipe is installed on the cooling heat sink plate,and reinstalled on the heat sink fins in order to enhance the cooling of high-power laser.Also,thermal simulation analysis of air-cooled semiconductor laser module is carried out based on ANSYS finite analysis soft-ware.Through the experiments of frequency redshift method,it is found that this method can obtain good heat dissipation effect in air cooling system.Moreover,the results show that combining heat pipes with high-power semiconductor laser air-cooling technology can overcome the limitations of water-cooling technology in complex environments,thus bringing new solutions to the problem of heat dissipation in high power semiconductor laser.
High power semiconductor laserHeat pipeANSYSTemperature distributionAir cooling
万方数据
维普
