Study On Stress Inhibition of Semiconductor Laser Bar Deformation
In order to suppress the encapsulation stress and deformation in the Y and Z axes of semiconductor laser devices,a dual heat-sink encapsulation structure for encapsulating a high-power semiconductor laser bar with a stress-adjustable mechanism realized by a screw is proposed. The finite element method is used to analyze the stress distribution of the two packaging structures of the semiconductor laser CS and the stress-adjustable dual heat sink,as well as the deformation of the two packages in the Y and Z axes direction under the CW continuous operating conditions,and the stress distribution of the Bar bar with different adjustable stresses is simulated. The analysis shows that the stress-adjustable dual heat sink package structure effectively reduces the working thermal stress and suppresses the smile effect and thermal lens effect,which provides certain theoretical support and reference for the stress suppression study of semiconductor laser bar.
semiconductor laserSmile effectthermal lens effectheat sinkpackage stressfinite element analysis
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