首页|邻苯二甲腈封端聚芳醚腈交联行为的研究进展

邻苯二甲腈封端聚芳醚腈交联行为的研究进展

扫码查看
邻苯二甲腈封端的聚芳醚腈(PEN-Ph)具有高耐热及高化学稳定性等特点,在航空航天和电子领域有广泛应用.通过后固相化学反应,PEN-Ph端基上的邻苯二甲腈及分子链的侧氰基可相互反应生成稳定的结构,使材料从线性结构转化为体型结构,提升耐温等级与机械性能.影响PEN-Ph交联反应的因素有内外2种,内因主要包括聚芳醚腈分子主链化学结构、分子量与分子量分布,以及邻苯二甲腈封端量等;外因主要包括热处理工艺、交联剂和催化剂等.基于此,重点阐述了外因如何影响PEN-Ph的交联行为及性能.此外,还成功制备了耐高温、高强度和高模量PEN-Ph单组分自增强复合材料,以期用于电容器薄膜及挠性覆铜板等领域.
Research Progress on Cross-Linking Behavior of Phthalonitrile Terminated with Polyarylene Ether Nitrile
Phthalonitrile terminated with polyarylene ether nitrile(PEN-Ph)is widely used in the aero-space and electronics fields due to its high temperature resistance and high chemical stability,etc.After applying post-solid phase chemical reaction technology,Phthalonitrice on the end group of PEN-Ph and the side cyanide group of the molecular chain can interact with each other to from a stable structure,which is transformed from linear to three-dimension network.Thus,the temperature-resistant level and mechani-cal performance are greatly enhanced.Specifically,there are two factors affecting PEN-Ph cross-linking re-action:internal factors mainly include main chain chemical structure,molecular weight and molecular weight distribution,the end-capping groups content;external factors mainly include the heat treatment process,cross-linking agent,and catalyst.Based on this,focusing on how external factors affect the cross-linking behavior and properties of PEN-Ph.In addition,PEN-Ph single-component composites with high temperature resistance,high strength and high modulus have been successfully prepared,which is expec-ted to be used in the fields of capacitor films and flexible copper clad laminates.

phthalonitrileterminalpolyarylene ether nitrilecross-linking reactionhigh-temperature-resistance

何亮、童利芬、刘孝波

展开 >

电子科技大学材料与能源学院,四川成都 610054

邻苯二甲腈 封端 聚芳醚腈 交联反应 耐高温

国家自然科学基金四川省科技计划重大专项

519030292019ZDZX0016

2024

成都大学学报(自然科学版)
成都大学

成都大学学报(自然科学版)

影响因子:0.357
ISSN:1004-5422
年,卷(期):2024.43(1)
  • 18