传感技术学报2024,Vol.37Issue(4) :589-596.DOI:10.3969/j.issn.1004-1699.2024.04.005

用于特殊环境的薄膜应变计的制备与表征

Fabrication And Characterization of Thin Film Strain Gauge for Strain Measurement Under Special Environment

张丛春 康志鹏 雷鹏 闫博
传感技术学报2024,Vol.37Issue(4) :589-596.DOI:10.3969/j.issn.1004-1699.2024.04.005

用于特殊环境的薄膜应变计的制备与表征

Fabrication And Characterization of Thin Film Strain Gauge for Strain Measurement Under Special Environment

张丛春 1康志鹏 2雷鹏 2闫博2
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作者信息

  • 1. 上海交通大学微米/纳米加工技术国家重点实验室,上海 200240,China
  • 2. 上海交通大学微米/纳米加工技术国家重点实验室,上海 200240,China;上海交通大学电子信息与电气工程学院,上海 200240,China
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摘要

使用磁控溅射制备了卡玛合金薄膜应变计,研究了退火温度对薄膜微观结构的影响,测试了薄膜的电学性能以及压阻响应特性,并进行了环境实验.结果表明,随着退火温度升高,薄膜的电阻率逐渐下降,电阻温度系数则逐渐升高,在室温下有最小的电阻温度系数(TCR),约为 59.9×10-6/℃,经过 200℃退火处理的薄膜应变计的应变灵敏度系数(GF)为 2.2,TCR为 64.4×10-6/℃.经历温湿循环、盐雾、霉菌试验后,薄膜的压阻特性变化不大,能耐受海洋特殊环境.

Abstract

RF sputtering is used to create Karma alloy thin film strain gauges on alumina substrates.Karma alloy thin films'changes in e-lectrical characteristics and strain properties at various annealing temperatures are evaluated,and it is determined how annealing tempera-ture affects the surface morphology and crystal structure of Karma alloy thin films.The results demonstrate that as the annealing tempera-ture increases,the resistivity of the Karma alloy thin films gradually decreases,and its temperature coefficient of resistance gradually in-creases.Karma thin film strain gages are discovered to have the lowest TCR of 59.9×10-6/℃under room temperature.After 200℃an-nealing process,the Karma alloy thin films achieve the gage factor of 2.2,and the TCR of 64.4×10-6/℃.The piezoresistive characteristic of the thin film changes slightly after experiments of temperature humidity cycling,salt spray,and molding,it has ability to withstand the harsh conditions of the sea.

关键词

磁控溅射/薄膜应变计/电阻温度系数/应变因子/环境实验

Key words

magnetron sputtering/thin-film strain gauge/resistance temperature coefficient/strain factor/environmental experiments

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基金项目

"慧眼行动"项目(2023)()

出版年

2024
传感技术学报
东南大学 中国微米纳米技术学会

传感技术学报

CSTPCDCSCD北大核心
影响因子:1.276
ISSN:1004-1699
参考文献量18
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