共蒸发法制备金锡共晶焊料环及其性能研究
Study on preparation and properties of gold-tin eutectic solder ring by coevaporation method
李萌萌 1李兆营 1黄添萍1
作者信息
- 1. 安徽光智科技有限公司,安徽滁州 239000
- 折叠
摘要
采用电子束共蒸发法制备了金锡共晶(Au80Sn20)焊料环,与非制冷红外探测器芯片进行气密性封装.通过SEM、AFM、X-ray、振荡测试以及测漏氦等方式验证了封装后芯片的气密性和可靠性.结果表明:键合后焊料环无明显缺陷,仅存在轻微溢料现象;经过振荡测试,溢料无脱落、无位移,且芯片密封性能可达到1 ×10-3Pa/(cm3·s),符合探测器的气密性要求.
Abstract
Electron beam coevaporation is used to prepare gold-tin eutectic(Au80 Sn20)solder rings for airtightness packaging with uncooled infrared detector chips.The airtightness and reliability of the packaged chips are verified through SEM,AFM,X-ray,vibration testing and helium leak testing.The result shows that there are no obvious defects in the solder ring after bonding,and only a slight overflow phenomenon exists.After vibration testing,the overflow material has no detachment or displacement,and the chip sealing performance can reach 1 × 10-3 Pa/(cm3·s),meeting the airtightness requirements of the detector.
关键词
非制冷红外探测器/晶圆级封装/电子束蒸发/金锡共晶焊料环/键合Key words
uncooled infrared detector/wafer level packaging/electron beam evaporation/gold-tin eutectic solder ring/bonding引用本文复制引用
出版年
2024
NETL
NSTL
维普
万方数据