Study on preparation and properties of gold-tin eutectic solder ring by coevaporation method
Electron beam coevaporation is used to prepare gold-tin eutectic(Au80 Sn20)solder rings for airtightness packaging with uncooled infrared detector chips.The airtightness and reliability of the packaged chips are verified through SEM,AFM,X-ray,vibration testing and helium leak testing.The result shows that there are no obvious defects in the solder ring after bonding,and only a slight overflow phenomenon exists.After vibration testing,the overflow material has no detachment or displacement,and the chip sealing performance can reach 1 × 10-3 Pa/(cm3·s),meeting the airtightness requirements of the detector.
NETL
NSTL
万方数据
维普
