In order to slove the difficult problem of complex assembly processes in sensor's manufacturing,the feasibility is investigated for integrated packaging of current sensors by low pressure injection molding technology.Firstly,the thermal sol filling process and the stress on sensitive device during the injection molding process are analyzed by simulation.Secondly,the homemade simple injection mold is used to verify the packaging effects for sensors.Finally,the raliability tests for current sensors are completed.The test results show that using low pressure injection molding technology in packaging of current sensors are feasible,which provides a reference basis for mass packaging and manufacturing of sensors.
维普
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