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CMOS红外光源的设计与实现

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基于红外气体传感器微型化、低成本和低功耗的发展需要,设计了一种用于非色散红外(NDIR)集成气体传感器的互补金属氧化物半导体(CMOS)红外光源.它以非等间隔的蛇形钨(W)薄膜电阻作为加热丝,以二氧化硅(SiO2)和氮化硅(Si3 N4)多层复合介质薄膜为支撑形成悬空膜片式微热板,以氧化铜(CuO)和二氧化锰(MnO2)纳米材料复合薄膜作为辐射增强层.基于COMSOL软件进行了热电耦合仿真,证明结构设计合理性.采用标准CMOS工艺、硅(Si)的深刻蚀工艺以及静电流体动力学打印技术流片制造了该CMOS红外光源芯片.性能测试结果表明:该红外光源从室温升温至 469℃的热响应时间约为41 ms,电功耗仅为138 mW,辐射区温度分布均匀,引入辐射增强层使表面比辐射率提高约35%,红外光源的辐射功率和红外光谱辐射强度测试结果表明:该涂层有效地增强了红外辐射.
Design and implementation of CMOS IR light source
Based on development needs of miniaturization,low cost and low power consumption of infrared(IR)gas sensor,a complementary metal oxide semiconductor(CMOS)IR light source for non-dispersive IR(NDIR)integrated gas sensor is designed.It uses S-shaped tungsten thin film resistor with unequal interval as heating wires,SiO2 and Si3 N4 multi-layer composite dielectric films as supports to form a micro-hotplate with a suspended membrane,and a CuO and MnO2 nanomaterial composite film as the radiation enhance layer.The thermoelectric coupling simulation is carried out based on COMSOL software to prove the rationality of structure design.The CMOS IR source chip is fabricated by standard CMOS process,deep etching process of silicon and electrostatic fluid dynamics printing technology.The results of the performance test show that the thermal response time of the IR source from room temperature to 469℃ is about 41 ms,the electrical power consumption is only 138 mW,and the temperature distribution in the radiation area is quite uniform.Introducing radiation enhance layer increases the surface specific emissivity by approximately 35%.Test results of the radiation power and radiation intensity of the IR source show that the coating effectively enhances the IR radiation.

CMOS infrared(IR)light sourcenon-dispersive infrared(NDIR)integrated gas sensorradiation enhanced layertungsten wire micro-hot plate

王林峰、余隽、李中洲、黄正兴、朱慧超、唐祯安

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大连理工大学电信学部生物医学工程学院辽宁省集成电路与生物医学电子系统重点实验室,辽宁大连 116024

互补金属氧化物半导体红外光源 非色散红外集成气体传感器 辐射增强层 钨丝微热板

国家重点研发计划资助项目国家自然科学基金资助项目

2019YFB200570261874018

2024

传感器与微系统
中国电子科技集团公司第四十九研究所

传感器与微系统

CSTPCD北大核心
影响因子:0.61
ISSN:1000-9787
年,卷(期):2024.43(2)
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