Key technology of pressure sensor chips are studied to satisfy the market demand for high-precision MEMS differential pressure sensors. In this study,a piezoresistive differential pressure sensor chip is designed,and the difficult problem of silicon-silicon direct bonding technology at room temperature is solved,and the stable and reliable processes suitable for mass production is developed. In the manufacturing process,bulk micromachining technology and silicon-silicon direct bonding technology are used. And high-precision differential pressure MEMS pressure sensor chips are prepared,which to meet practical application needs. Piezoresistive differential pressure sensor chips are prepared that with a pressure measurement range of 0～14 MPa,linearity error(>10 kPa)<0.3％FS,temperature hysteresis<±0.05％FS,pressure hysteresis<0.05％FS,working temperature is-40～+85℃,overload capacity ≥2 times FS. This research provides a feasible referred option for the design and production of piezoresistive pressure chips.
关键词
差压传感器/MEMS芯片/体微加工/KOH刻蚀/硅—硅键合
Key words
differential pressure sensor/MEMS chip/bulk micromachining/KOH etching/Si-Si direct bonding
维普
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