Design of low-stress packaging substrate based on MEMS inkjet printed chip
Inkjet printed chip is fabricated based on MEMS technology with liquid-driven MEMS structures integrated inside,and MEMS structures are stress-sensitive by nature,so the stress generated by packaging process will seriously affect the reliability and long-term stability of MEMS inkjet printed chip. Based on MEMS inkjet printed chip,three different types of packaging substrates are designed from both structural and material aspects,i. e.,cylindrical PPS resin substrate,non-cylindrical PPS resin substrate and non-cylindrical ceramic substrate,and the three kinds of substrates are verified by combination of finite element simulation and actual measurements,and finally the least stress among the three groups of packaging substrates is the non-cylindrical ceramic substrate. The simulation analysis is consistent with the actual results,which proves that this design can effectively reduce the stress in the MEMS inkjet printed chip package structure.
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维普
