Thermal interface materials are applied to enhance thermal contact between electronic devices and heat sinks. Its high thermal conductivity and good mechanical compliance can improve the heat dissipation efficiency of electronic devices while reducing thermal stress caused by thermal expansion at the same time. The vertically arranged copper nanowires(CuNWs)arrays are high-performance thermal interface materials which combine high thermal conductivity and compliance. The interface heat transfer performance of CuNWs arrays in thermal environment based on the phase sensitive transient thermal reflection method is investigated. The experimental results indicate that the contact thermal conductance between the CuNWs array and the substrate remains stable in thermal environment. The numerical simulation result shows that the introduction of CuNWs arrays produces low stress effect,which can suppress the generation and expansion of interface defects. This work indicates that CuNWs arrays can effectively regulate thermal stress,thus enhancing the reliability of thermal interfaces.
维普
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