首页|Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity

Boron nitride silicone rubber composite foam with low dielectric and high thermal conductivity

扫码查看
原文链接
  • NETL
  • NSTL
  • 万方数据
Silicone rubber(SR)is widely used in the field of electronic packaging because of its low dielectric properties.In this work,the porosity of the SR was improved,and the dielectric constant of the SR foam was reduced by adding expanded microspheres(EM).Then,the thermal conductivity of the system was improved by combining the modified boron nitride(f-BN).The results showed that after the f-BN was added,the dielectric constant and dielectric loss were much lower than those of pure SR.Micron-sized modified boron nitride(f-mBN)improved the dielectric and thermal conductivity of the SR foam better than that of nano-sized modified boron nitride(f-nBN),but f-nBN improved the volume resistivity,tensile strength,and thermal stability of the SR better than f-mBN.When the mass ratio of f-mBN and f-nBN is 2:1,the thermal conductivity of the SR foam reaches the maximum value of 0.808 W.m-1·K-1,which is 6.5 times that before the addition.The heat release rate and fire growth index are the lowest,and the improvement in flame retardancy is mainly attributed to the high thermal stability and physical barrier of f-BN.

FoamCompositesDielectric propertiesThermal conductivityMechanical propertiesFlame retardant

Shuilai Qiu、Hang Wu、Fukai Chu、Lei Song

展开 >

College of Safety and Ocean Engineering,China University of Petroleum-Beijing,Beijing 102249,China

State Key Laboratory of Fire Science,University of Science and Technology of China,Hefei 230026,China

Natural Science Foundation of Anhui ProvinceNational Natural Science Foundation of ChinaScience Foundation of China University of Petroleum,Beijing

2108085QE211222052292462024QNXZ001

2024

10.1016/j.cjche.2024.01.012

中国化学工程学报(英文版)
中国化工学会

中国化学工程学报(英文版)

CSTPCDEI
影响因子：0.818
ISSN：1004-9541
年,卷(期)：2024.68(4)
  • 24