首页|Highly Conductive Ag/pCF/MVQ Composite Rubber for Efficient Electromagnetic Interference Shielding

Highly Conductive Ag/pCF/MVQ Composite Rubber for Efficient Electromagnetic Interference Shielding

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In this study,flexible and highly conductive composite rubber at low filler content was successfully prepared through polydopamine-assisted electroless silver plating plus mechanical mixing.Firstly,carbon fibers(CF)were activated by polydopamine(PDA)to improve the sur-face activity by self-polymerization reaction.Next,because of the metal chelating ability of PDA,silver layer was firmly deposited on the surface of CF through a facile electroless silver plating method.Finally,flexible silver-plated carbon fibers(Ag/pCF)silicone rubber composites prepared by mechanical mixing.By using X-ray photoelectron spectroscopy(XPS)and X-ray diffraction(XRD),the chemical composition and crystal structure of Ag/pCF were examined,and scanning electron microscopy(SEM)was used to assess the surface morphology of the Ag/pCF.The results showed that a uniform and dense silver layer was formed on the surface of the CF,and the conductivity of the Ag/pCF could reach 7885 S/cm.It was noteworthy that the composite rubber filled with only 45 phr Ag/pCF had a high electromagnetic interference shielding effectiveness(100 dB)due to the low density and high aspect ratio of Ag/pCF.The composite rubber has excellent potential for application in the field of electro-magnetic interference shielding.

Carbon fibersPolydopamineElectroless platingSilverElectromagnetic interference shielding

Yang Chen、Xiao-Ming Shao、Liang He、Yi-Nuo Xu、Qi-Yuan Yao、Ding Feng、Wen-Cai Wang

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State Key Laboratory of Organic-Inorganic Composites,Beijing University of Chemical Technology,Beijing 100029,China

Key Laboratory of Beijing City for Preparation and Processing of Novel Polymer Materials,Beijing University of Chemical Technology,Beijing 100029,China

Sino-german School of Engineering,Qingdao University of Science and Technology,Qingdao 266400,China

国家自然科学基金

51833002

2024

高分子科学(英文版)
中国化学会 中国科学院化学研究所

高分子科学(英文版)

CSTPCD
影响因子:0.721
ISSN:0256-7679
年,卷(期):2024.42(6)