首页|Comparative Study of Intrachain versus Interchain Cross-linking on the Mechanical,Thermal and Dielectric Properties of Low-k Polyimide

Comparative Study of Intrachain versus Interchain Cross-linking on the Mechanical,Thermal and Dielectric Properties of Low-k Polyimide

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Polyimide(PI)is widely used in high-frequency communication technology due to its exceptional comprehensive properties.Howev-er,traditional PI has a relatively elevated dielectric constant and dielectric loss.Herein,the different cross-linked structures were introduced in PI matrix and conducted a detailed discussion on the influence of cross-linking agent content and cross-linking structure type on the overall perfor-mance of PI films.In comparison to the dielectric constant of 2.9 of neat PI,PI with an interchain cross-linking structure containing 2 wt%1,3,5-tris(4-aminophenyl)benzene(TAPB)(interchain-PI-2)exhibited the reduced dielectric constant of 2.55 at 1 MHz.The PI films with intrachain cross-linking structure containing 2 wt%TAPB(intrachain-PI-2)exhibited the lowest dielectric constant of 2.35 and the minimum dielectric loss of 0.0075 at 1 MHz.It was due to the more entanglement junctions of intrachain-PI resulting in decreased carrier transport.The thermal expansion coefficients of both interchain-PI and intrachain-PI films were effectively reduced.Moreover,in contrast to interchain-PI films,the intrachain-PI films maintained colorlessness and transparency as the cross-linking agent content increased.This work compared the effects of two different cross-linked structures on the performance of PI films and provided a feasible way to obtain low-k PI films with excellent comprehensive perfor-mance for 5G applications.

Interchain cross-linkingIntrachain cross-linkingPolyimideLow dielectric

Wan-Jing Zhao、Yi-Zhang Tong、Pei-Pei Zeng、Yang-Sheng Zhou、Xian-Wu Cao、Wei Wu

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National Engineering Research Center of Novel Equipment for Polymer Processing,Key Laboratory of Polymer Processing Engineering of Ministry of Education,Guangdong Provincial Key Laboratory of Technique and Equipment for Macromolecular Advanced Manufacturing,School of Mechanical and Automotive Engineering,South China University of Technology,Guangzhou 510640,China

Guangdong Provincial Key Laboratory of Distributed Energy Systems,Guangdong Provincial Engineering Research Center of Distributed Energy Systems,Dongguan University of Technology,Dongguan 523808,China

Engineering Center for Superlubricity,Jihua Laboratory,Foshan 528200,China

2024

高分子科学(英文版)
中国化学会 中国科学院化学研究所

高分子科学(英文版)

CSTPCD
影响因子:0.721
ISSN:0256-7679
年,卷(期):2024.42(11)