首页|新型水基高分子焊锡球表面处理剂及其性能研究

新型水基高分子焊锡球表面处理剂及其性能研究

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为解决焊锡球在长期存放与运输过程中易被氧化的问题,以Sn3.0Ag0.5Cu焊锡球为研究对象,研制出一种新型水基高分子焊锡球表面处理剂,此种表面处理剂是由苯并三氮唑和聚乙烯醇4000作为成膜剂,使用抗坏血酸作为抗氧化剂,并添加少量碱性配位剂与表面活性剂制成.表面处理剂处理后对焊锡球进行抗氧化性测试、剪切强度测试、空洞测试以及包覆情况测试与Raman光谱表征,结果表明:经此种表面处理剂处理后的焊锡球焊点剪切强度提高48%;焊锡球焊点空洞率低于4%,符合业内要求(低于15%).上述结果说明此种表面处理剂处理过后的焊锡球会在表面形成一层致密的抗氧化薄膜,能提高焊球的抗氧化性能.
Study on Novel Water-Based Polymer Surface Treatment Agent for Solder Ball and Its Performance
In order to solve the problem of solder balls being prone to oxidation during long-term storage and transportation,a novel water-based polymer surface treatment agent for solder balls was prepared and researched,with solder balls of Sn3.0Ag0.5Cu serving as the research object.The surface treatment agent was formulated with benzotriazole and polyvinyl alcohol 4000 as film-forming agents,using ascorbic acid as an antioxidant,and incorporating a small amount of alkaline complexing agents and surfactants.The solder balls,processed by this surface treatment agent,were characterized through an oxidation resistance test,shear strength test,cavity test,coating condition test and Raman spectroscopy.Results showed that after treatment with this surface agent,the shear strength of the solder joint of the solder ball increased by 48%;the cavity rate of the solder joint of the solder ball was less than 4%,meeting the industry requirements(less than 15%).These results indicated that the solder balls treated with this surface treatment agent formed a dense anti-oxidation film on their surface,improving the oxida-tion resistance of the solder balls.

surface treatment agentSn3.0Ag0.5Cusolder ballsoxidation resistancewelding performance

王同举、林子彭、张文倩、雷永平、吴宇庭、刘亚浩、冷启顺

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北华航天工业学院电子与控制工程学院,河北廊坊 065000

北京工业大学材料与制造学部,北京 100000

表面处理剂 Sn3.0Ag0.5Cu 焊锡球 抗氧化性 焊接性能

河北省高等学校科学技术研究项目河北省科技重大专项装备预研教育部联合基金河北省自然科学基金河北省高等学校科学技术研究基金项目

QN202311921280201Z8091B022103F2021409006QN2020102

2024

材料保护
武汉材料保护研究所,中国腐蚀与防护学会 中国表面工程协会

材料保护

CSTPCD
影响因子:1.129
ISSN:1001-1560
年,卷(期):2024.57(4)
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