首页|硫脲对电解高性能双面光锂电铜箔性能的影响

硫脲对电解高性能双面光锂电铜箔性能的影响

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为研究硫脲质量浓度对铜箔表面形貌、结构、性能以及电解液电化学行为的影响,以磷铜板为阳极,以硫脲(TU)、羟乙基纤维素(HEC)、聚乙二醇(PEG-1000)和聚二硫二丙烷磺酸钠(SPS)作为组合添加剂,采用自制旋转电镀装置以直流电沉积法在TAl钛辊上制备电解铜箔,并利用扫描电子显微镜、铜箔拉伸强度试验仪以及电化学分析等方法,重点考察了组合添加剂中TU对铜箔表面形貌和物理性能的影响.结果表明:在组合添加剂体系中TU具有较强的极化作用,可以抑制铜核的生长,使铜箔结晶更细致,有效地起到光亮和整平作用并提高铜箔力学性能,且组合添加剂间表现出较好的协同效应.在高性能锂电铜箔的制备过程中,可通过适当调整电解液中硫脲的加入量来改善电解铜箔的各项性能.
Effects of Thiourea on Electrolytic High-Performance Dual-Sided Lithium Copper Foil Properties
To investigate the effects of mass concentration of thiourea (TU) on the surface morphology, structure and properties of copper foil, as well as the electrochemical behavior of the electrolyte, phosphor copper plate was used as the anode, thiourea (TU) , hydroxyethyl cellulose (HEC), polyethylene glycol (PEG-1000) and sodium polydithiodipropane sulfonate (SPS) were employed as combined additives. The elec-trolytic copper foil was fabricated on a TAl titanium roller using a homemade rotary electroplating device with direct current deposition method. The influence of TU as part of the combined additives on the surface morphology and physical properties of the copper foil was examined using scanning electron microscopy, copper foil tensile strength tester and electrochemical analysis methods. Results showed that within the combined additive system, TU exhibited strong polarization effect, which inhibited the growth of copper nuclei, leading to finer copper foil crystallization. This effect not only enhanced the brightness and leveling of the copper foil but also improved its mechanical properties. Furthermore, a signifi-cant synergistic effect was observed among the combined additives. During the preparation process of high-performance lithium copper foil, ad-justing the addition of thiourea in the electrolyte could improve the various performances of electrolytic copper foil.

electrolytic copper foiltensile strengthadditivesthiourea

刘燕、陈志林、孔令花、张倩倩、王永森、唐春保

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嘉应学院化学与环境学院,广东 梅州 514015

电解铜箔 抗拉强度 添加剂 硫脲

嘉应学院教学改革项目大学生创新创业训练计划嘉应学院科研项目

JYJG2022233S2022105822752023KJY21

2024

材料保护
武汉材料保护研究所,中国腐蚀与防护学会 中国表面工程协会

材料保护

CSTPCD
影响因子:1.129
ISSN:1001-1560
年,卷(期):2024.57(5)
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