首页|低浓度硫酸铜对化学镀Ni-P镀层微观结构及性能的影响

低浓度硫酸铜对化学镀Ni-P镀层微观结构及性能的影响

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为改善镍磷(Ni-P)镀层的表面质量、提高Ni-P镀层的性能,在化学镀Ni-P镀液中加入少量的硫酸铜(CuSO4·5H2O)制备Ni-P镀层.利用扫描电镜、能谱仪、X射线衍射仪分析了镀层的表面形貌、成分和结构,研究了CuSO4·5H2O浓度对镀层的微观结构、表面粗糙度、光泽度、硬度、耐磨性和耐蚀性的影响.研究表明:当CuSO4·5H2O浓度为0.1 g/L时,镀层为致密的非晶态节瘤状组织,具有最佳的耐蚀性;当CuSO4·5H2O浓度为0.2 g/L时,镀层表面质量最好,硬度高、耐磨性优异,但镀层中出现少量微晶态Ni-Cu固溶体,耐蚀性下降;当CuSO4·5H2O浓度超过0.2 g/L后,镀层为混晶态菜花状组织,镀层表面的质量和耐蚀性随CuSO4·5H2O浓度的增加不断恶化.
Effects of Low-Concentration Copper Sulfate on the Microstructure and Properties of Electroless Ni-P Coatings
In order to improve the surface quality and properties of nickel-phosphorus (Ni-P) coatings,a small quantity of copper sulfate (CuSO4·5H2O) was added to the electroless Ni-P plating solution to prepare Ni-P coatings. The surface morphology,composition and struc-ture of the coatings were analyzed using scanning electron microscopy,energy-dispersive spectroscopy and X-ray diffractometer. The effects of CuSO4·5H2O concentration on the microstructure,surface roughness,glossiness,hardness,wear resistance and corrosion resistance of the coatings were investigated. Results showed that when the concentration of CuSO4·5H2O was 0.1 g/L,the coating exhibited a dense,amor-phous nodular structure with the best corrosion resistance. At a concentration of 0.2 g/L,the coating had the best surface quality,high hard-ness and excellent wear resistance,but a small amount of microcrystalline Ni-Cu solid solution appeared in the coating,leading to decreased corrosion resistance. When the concentration of CuSO4·5H2O exceeded 0.2 g/L,the coating formed a mixed crystalline cauliflower-like struc-ture,and both the surface quality and corrosion resistance of the coating deteriorated with increasing CuSO4·5H2O concentration.

electroless platingNi-P coatingcopper sulfate concentrationmicroscopic structurewear resistancecorrosion resistance

周柏玉、黄仁超

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郴州职业技术学院现代装备制造学院,湖南 郴州 423000

化学镀 Ni-P镀层 硫酸铜浓度 微观结构 耐磨性 耐蚀性

湖南省教育厅科学研究项目

22B0946

2024

材料保护
武汉材料保护研究所,中国腐蚀与防护学会 中国表面工程协会

材料保护

CSTPCD
影响因子:1.129
ISSN:1001-1560
年,卷(期):2024.57(6)
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