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rGO@Al2O3填充导热硅凝胶的制备及性能研究

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石墨烯的高导热性在电子系统热管理领域显示出巨大潜力.采用聚二烯丙基二甲基氯化铵(PDDA)修饰球形Al2O3,使Al2O3表面带正电,与带负电的氧化石墨烯,通过静电力组装结合后,经过高温热还原得到rGO@Al2O3杂化填料,将杂化填料填充到硅橡胶的双组分中,进一步制备了rGO@Al2O3增强的导热硅凝胶.采用AFM,SEM,Raman和XRD等对制备过程中材料的形貌和结构进行表征,并对导热硅凝胶的导热性能和力学性能进行了测试分析.质量分数为2%GO制备的rGO@Al2O3,其填充导热硅凝胶的导热系数为0.817 W/(m·K),对比填充纯Al2O3的导热硅凝胶,在导热性能上有很大提升.
Preparation and properties of rGO@Al2O3 filled thermal conductive silicon gel
The high thermal conductivity of graphene shows great potential in the thermal management of electronic systems. Spherical Al2O3 was modified by polydiallyl dimethyl ammonium chloride (PDDA) to make the surface of Al2O3 positively charged,and then combined with negatively charged graphene oxide through electrostatic assembly. After high temperature thermal reduction,rGO@Al2O3 hybrid filler was obtained,and the hybrid filler was filled into the two-component silicone rubber. The thermal silicon gel enhanced by rGO@Al2O3 was further prepared. Then,the morphology and structure of the material during the preparation process were characterized by AFM,SEM,Raman,XRD,etc.,and the thermal conductivity and mechanical properties of thermal silicon gel were tested and analyzed. The thermal conductivity of thermal silicon gel which filled with rGO@Al2O3 prepared by 2% (mass fraction)GO is 0.817 W/(m·K). Compared with the thermal conductive silicon gel filled with pure Al2O3,the thermal conductivity of rGO@Al2O3 silicon gel has been greatly improved.

graphenecomposite materialfillingthermal conductivesilicon gel

文芳、王良旺、李爽、郭华超、刘斌

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广州特种承压设备检测研究院国家石墨烯产品质量检验检测中心(广东),广州 510030

石墨烯 复合材料 填充 导热 硅凝胶

2024

材料工程
中国航发北京航空材料研究院

材料工程

CSTPCD北大核心
影响因子:0.78
ISSN:1001-4381
年,卷(期):2024.52(10)