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钛合金电辅助成形本构模型及仿真研究进展

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电流辅助成形技术具有降低材料变形抗力、提高零件成形精度等优点,已被广泛应用于轻质难变形钛合金的高质量精密成形.电流引起的焦耳热效应和非热效应的综合作用会对钛合金的力学性能和微观组织产生多重影响.因此,传统本构模型能否准确描述电辅助成形过程中材料的力学行为仍存在争议.基于此,首先总结了有关电致塑性效应机理的研究,阐明了电流对钛合金宏观力学行为和微观组织演变的影响规律.其次,梳理了目前电流辅助成形过程中材料本构模型的先进性与局限性,以及综述了借助不同尺度下的计算机仿真方法研究钛合金电辅助成形过程.最后,展望了钛合金电辅助成形本构模型及仿真技术的研究方向.
Research Progress on Constitutive Modeling and Simulation of Electrically-Assisted Forming of Titanium Alloys
Electrically-assisted technology has the advantages of reducing the material deformation resistance and improving the forming accuracy of parts,and has been widely used in the high-quality precision forming of lightweight and difficult-to-deform titanium alloys.The combined effect of Joule thermal effect and athermal effect induced by electric current has multiple influ-ences on the mechanical properties and microstructures of titanium alloys.Therefore,it is still controversial whether the tradi-tional constitutive models can accurately describe the mechanical behaviors of materials in electrically-assisted forming process.In this paper,firstly,we summarize the studies on the electroplastic effect mechanism,and clarify the influence of electric cur-rent on macroscopic mechanical behaviors and microstructure evolutions of titanium alloys.Secondly,the advancements and lim-itations of current material constitutive models in the electrically-assisted forming process are sorted out,and how to investigate the electrically-assisted forming process of titanium alloys with the aid of computer simulation methods at different scales is re-viewed.Finally,the future research trends of constitutive model and simulation technology of electrically-assisted forming of ti-tanium alloy are envisioned.

titanium alloyselectroplasticityconstitutive modelfinite element methodmolecular dynamics

雷奕文、刘焱、张骞文、贺文勃、李细锋

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上海交通大学材料科学与工程学院塑性成形技术与装备研究院,上海 200030

首都航天机械有限公司,北京 100076

中航西安飞机工业集团股份有限公司,陕西西安 710089

钛合金 电致塑性 本构模型 有限元法 分子动力学

国家重点研发计划项目国防基础科研计划项目

2022YFB3402200JCKY2023110C011

2024

材料开发与应用
洛阳船舶材料研究所 中国造船工程学会船舶材料学术委员会

材料开发与应用

CSTPCD
影响因子:0.342
ISSN:1003-1545
年,卷(期):2024.39(4)
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