材料科学技术(英文版)2021,Vol.65Issue(6) :202-209.

Supermodulus effect by grain-boundary wetting in nanostructured multilayers

Jing wang Lu Han Xiaohu Li Dongguang Liu Laima Luo Yuan Huang Yongchang Liu Zumin Wang
材料科学技术(英文版)2021,Vol.65Issue(6) :202-209.

Supermodulus effect by grain-boundary wetting in nanostructured multilayers

Jing wang 1Lu Han 1Xiaohu Li 2Dongguang Liu 3Laima Luo 4Yuan Huang 1Yongchang Liu 1Zumin Wang1
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作者信息

  • 1. State Key Lab of Hydraulic Engineering Simulation and Safety, School of Materials Science and Engineering, Tianjin University, Tianjin 300350, China
  • 2. German Engineering Materials Centre at MLZ, Helmholtz-Zentrum Geestacht, D-85747 Garching, Germany
  • 3. Institute of Industry and Equipment Technology, Hefei University of Technology, Hefei 230009, China
  • 4. School of Materials Science and Engineering, Hefei University of Technology, Hefei 230009, China
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Abstract

The effect of thermal treatments on mechanical properties was systematically investigated in Ni/Mo multilayers with a constant modulation period (160 nm) prepared by magnetron sputtering deposition.A supermodulus effect was found in the annealed multilayers as compared to the as-deposited state.A large tensile stress development was observed in the multilayers.The evolution of grain-boundary (GB) wetting was observed at the interfaces of the multilayers,which results in an enhanced modulus based on the mechanism of GB-wetting-induced interfacial stress/strain.The GB wetting phenomenon was further supported by a thermodynamic calculation.The results not only bring clear evidence of the important role of interracial structures in governing the elastic behavior of metallic multilayers,but also allow designing the multilayers with special properties through atomic diffusion and wetting at the interfaces based on the thermodynamic calculation.

Key words

Multilayer/Elastic modulus/Grain-boundary wetting/Stress/Thermodynamic calculation

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基金项目

出版年

2021
材料科学技术(英文版)
中国金属学会 中国材料研究学会 中国科学院金属研究所

材料科学技术(英文版)

CSTPCDCSCDSCI
影响因子:0.657
ISSN:1005-0302
参考文献量53
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