材料科学技术(英文版)2021,Vol.68Issue(9) :35-39.

Detailing interfacial reaction layer products between cubic boron nitride and Cu-Sn-Ti active filler metal

Yonggang Fan Junxiang Fan Cong Wang
材料科学技术(英文版)2021,Vol.68Issue(9) :35-39.

Detailing interfacial reaction layer products between cubic boron nitride and Cu-Sn-Ti active filler metal

Yonggang Fan 1Junxiang Fan 1Cong Wang1
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作者信息

  • 1. School of Metallurgy, Northeastern University, Shenyang 110819, China
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Abstract

In the present study,we offer an in-depth analysis over the microstructure,thickness and product composition of the interfacial reaction layer generated upon CBN/Cu-Sn-Ti active filler metal at 1223 K.Current findings demonstrate that adequate wettability and satisfactory bonding have been achieved via chemical reactions between Ti and N,B.More importantly,we report,for the first time,the formation of a three-layer juxtaposition of reaction products,namely,TiN,TiB2 and TiB,along the diffusion path of Ti.Meanwhile,we determine the average layer thickness to be 1.24 μm.Through deep etching,we unambiguously present morphologies of the newly formed TiN and TiB2,which are columnar and bulky,respectively,and constitute the formation of a high strength metallurgical interfacial bonding layer,and is crucial towards gaining enhanced grinding performance.Finally,we propose a possible reaction sequence and mechanism that govern the nucleation and growth of corresponding crystals.

Key words

Brazing/Cubic boron nitride/Cu-Sn-Ti/Interfacial products

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基金项目

This work was financially supported by the National Natural Science Foundation of China(51622401)

This work was financially supported by the National Natural Science Foundation of China(51861130361)

This work was financially supported by the National Natural Science Foundation of China(51861145312)

This work was financially supported by the National Natural Science Foundation of China(51850410522)

Newton Advanced Fellowship by Royal Society(RP12G0414)

Research Fund for Central Universities(N172502004)

Research Fund for Central Universities(N2025025)

Xing Liao Talents Program(XLYC1807024)

Xing Liao Talents Program(XLYC1802024)

NEU Innovation Team Project,and the Global Talents Recruitment Program endowed by the Chinese Government()

We would also like to thank the State Key Laboratory of Solidification Processing,Northwestern Polytechnical University(SKLSP201805)

出版年

2021
材料科学技术(英文版)
中国金属学会 中国材料研究学会 中国科学院金属研究所

材料科学技术(英文版)

CSTPCDCSCDSCI
影响因子:0.657
ISSN:1005-0302
参考文献量36
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