材料科学技术(英文版)2021,Vol.77Issue(18) :82-89.

Rapid Growth of TiNi intermetallic compound within undercooled Ti50Ni50 alloy under electrostatic levitation condition

P.F.Zou C.H.Zheng L.Hu H.P.Wang
材料科学技术(英文版)2021,Vol.77Issue(18) :82-89.

Rapid Growth of TiNi intermetallic compound within undercooled Ti50Ni50 alloy under electrostatic levitation condition

P.F.Zou 1C.H.Zheng 1L.Hu 1H.P.Wang1
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作者信息

  • 1. School of Physical Science and Technology,Northwestern Polytechnical University,Xi'an,710072,China
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Abstract

The undercooling dependence of the solidification mechanism was systematically explored by the elec-trostatic levitation(ESL)facility.During the experiments,the maximum undercooling reached up to 406 K(0.26 TL)and the growth velocity of the primary TiNi phase was in-situ determined at various undercool-ings.At the initial increase of alloy undercooling,the value of growth velocity sluggishly rose followed by a power function.In this case,the primary TiNi phase preferentially developed as the equiaxed dendrite,then the remnant liquid participated as Ti2Ni and α-Ti phases on the grain boundary.Once the under-cooling exceeded the critical value of 350 K,the growth velocity of the primary phase displayed a sharply increase tendency.Meanwhile,the TEM results demonstrated that the precipitation of the intermetallic Ti2Ni compound was gradually restrained during the rapid solidification and the R-phase existing in the TiNi matrix at large undercooling implied that the martensitic transformation was incomplete.

Key words

Undercooling/Ti-Ni alloy/Solidification/Growth kinetics

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基金项目

出版年

2021
材料科学技术(英文版)
中国金属学会 中国材料研究学会 中国科学院金属研究所

材料科学技术(英文版)

CSTPCDCSCDSCI
影响因子:0.657
ISSN:1005-0302
被引量1
参考文献量31
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