Achieving very high cycle fatigue performance of Au thin films for flexible electronic applications

Hong-Lei Chen ¹Xue-Mei Luo ²Dong Wang ³Peter Schaaf ³Guang-Ping Zhang²

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作者信息

1. Shenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China;School of Materials Science and Engineering,University of Science and Technology of China,Shenyang 110016,China
2. Shenyang National Laboratory for Materials Science,Institute of Metal Research,Chinese Academy of Sciences,Shenyang 110016,China
3. Institute of Materials Engineering and Institute of Micro-and Nanotechnologies MacroNano(R),TU Ilmenau,Gustav-Kirchhoff-Str.5,98693 Ilmenau,Germany
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Abstract

The fatigue damage behavior of the nanocrystalline Au films on polyimide substrates was investigated.It was found that the very high-cycle fatigue damage resistance of the Au film was significantly enhanced by at least a factor of ～2 in supported loading through adding an ultrathin Ti interlayer at the Au film/polyimide interface.Such a better fatigue damage resistance is mainly ascribed to the effective suppression of voiding at the Au film/polyimide interface through modulation of the Au/Ti interface,and thus the propensity of the cyclic strain localization and grain boundary cracking is reduced.The finding may provide a potential strategy for the design of flexible devices with ultra-long fatigue life.

Key words

Thin films/Ti interlayer/Fatigue/Extrusion/Interface

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基金项目

National Natural Science Foundation of China(NSFC)(52071319)

National Natural Science Foundation of China(NSFC)(51601198)

National Natural Science Foundation of China(NSFC)(51771207)

Foundation for Outstanding Young Scholar sponsored by Institute of Metal Research(IMR)()

Natural Science Foundation of Liaoning Province of China(20180510025)

Foundation for Outstanding Young Scholar sponsored by the Shenyang National Laboratory for Materials Science(L2019F23)

出版年

2021

材料科学技术(英文版)

中国金属学会中国材料研究学会中国科学院金属研究所

材料科学技术(英文版)

CSTPCDCSCDSCI

影响因子：0.657

ISSN：1005-0302

参考文献量52

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