Elimination of extraordinarily high cracking susceptibility of aluminum alloy fabricated by laser powder bed fusion

Holden Hyer ¹Le Zhou ²Sharon Park ³Thinh Huynh ⁴Abhishek Mehta ⁴Saket Thapliyal ⁵Rajiv S.Mishra ⁵Yongho Sohn⁴

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作者信息

1. Department of Materials Science and Engineering,University of Central Florida,Orlando,FL,USA;Now Research Scientist,Oak Ridge National Laboratory,Oak Ridge,TN,USA
2. Department of Materials Science and Engineering,University of Central Florida,Orlando,FL,USA;Now Assistant Professor,Marquette University,Milwaukee,WI,USA
3. Department of Materials Science and Engineering,University of Central Florida,Orlando,FL,USA;Now PhD Candidate,Johns Hopkins University,Baltimore,MD,USA
4. Department of Materials Science and Engineering,University of Central Florida,Orlando,FL,USA
5. Center for Friction Stir Processing,Department of Materials Science and Engineering,Advanced Materials and Manufacturing Processes Institute,University of North Texas,Denton,TX,USA
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Abstract

Using the calculation of phase diagrams approach and Scheil solidification modeling,the Al-2.5Mg-1.0Ni-0.4Sc-0.1Zr alloy was designed,intentionally with an extraordinarily high cracking susceptibility,making it prime for solidification cracking during laser powder bed fusion.This study demonstrates the abil-ity to mitigate even the most extreme solidification cracking tendencies in aluminum alloys with only minor alloying additions of Sc and Zr,0.5 wt.％max.Furthermore,by employing a simple direct ageing heat treatment,good tensile mechanical properties were observed with a yield strength of 308 MPa,an ultimate tensile strength of 390 MPa,and a total elongation of 11％.

Key words

Additive manufacturing/Cracking susceptibility/Aluminum alloy/CALPHAD/Mechanical properties

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基金项目

Office of Naval Research under the ONR(N00014-17-1-2559)

materials characterization facility MCF)at UCF for their microscopy facility and the materials research facility MRF)at UNT ()

出版年

2022

材料科学技术(英文版)

中国金属学会中国材料研究学会中国科学院金属研究所

材料科学技术(英文版)

CSTPCDCSCDSCI

影响因子：0.657

ISSN：1005-0302

参考文献量30

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