材料科学技术(英文版)2022,Vol.115Issue(20) :251-255.

Oxidation-enhanced bonding strength of Cu sinter joints during thermal storage test

Yue Gao Jinting Jiu Chuantong Chen Katsuaki Suganuma Rong Sun Zhi-Quan Liu
材料科学技术(英文版)2022,Vol.115Issue(20) :251-255.

Oxidation-enhanced bonding strength of Cu sinter joints during thermal storage test

Yue Gao 1Jinting Jiu 2Chuantong Chen 3Katsuaki Suganuma 3Rong Sun 4Zhi-Quan Liu4
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作者信息

  • 1. Shenzhen Institute of Advanced Electronic Materials,Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055,China
  • 2. Senju Metal Industry Co.,Ltd.,Senju Hashido-cho 23,Adachi-ku Tokyo 120-8555,Japan
  • 3. The Institute of Scientific and Industrial Research(ISIR),Osaka University,Mihogaoka 8-1,Ibaraki,Osaka 567-0047,Japan
  • 4. Shenzhen Institute of Advanced Electronic Materials,Shenzhen Institute of Advanced Technology,Chinese Academy of Sciences,Shenzhen 518055,China;Shenzhen College of Advanced Technology,University of Chinese Academy of Sciences,Shenzhen 518055,China
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出版年

2022
材料科学技术(英文版)
中国金属学会 中国材料研究学会 中国科学院金属研究所

材料科学技术(英文版)

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影响因子:0.657
ISSN:1005-0302
参考文献量28
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