首页|How the surface Cu layer affected the activity of Ni foil for alkaline hydrogen evolution

How the surface Cu layer affected the activity of Ni foil for alkaline hydrogen evolution

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Synthesizing bimetallic nanomaterials,with noble metals as the surface layers and inert metals as the substrates,has been proven to be an effective way to reduce the use of noble metals with maintained cat-alytic activity.However,an atomic diffusion from the inert substrate to the surface during the long-term operation has been reported to significantly decrease the activity.In this work,a series of catalysis-inert Cu-coated Ni foil were fabricated through electrodeposition and their activities for alkaline hydrogen evo-lution were investigated.Notably,the Ni/Cu-60 sample showed a similar catalytic property with pure Ni foil and only a slight decrease in HER activity was observed.The X-ray photoelectron spectroscopy(XPS)results indicated a decreased electron concentration of Cu in Ni/Cu-60,and theoretical calculations further demonstrated the electron transfer between the Ni substrate and Cu layer.Our results reveal that a spe-cific composition or structure of an inert metal layer might not significantly decrease the electrocatalytic activity of active metals.Moreover,there are more possibilities for the rational design of metal-based catalysts for electrocatalysis.

Bimetallic heterostructureCharge redistributionWater splittingAlkaline hydrogen evolution

Qingfeng Hu、Yuan Liu、Xuerong Zheng、Jinfeng Zhang、Jiajun Wang、Xiaopeng Han、Yida Deng、Wenbin Hu

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School of Materials Science and Engineering,Key Laboratory of Advanced Ceramics and Machining Technology of Ministry of Education,Tianjin University,Tianjin 300072,China

State Key Laboratory of Marine Resource Utilization in South China Sea,School of Materials Science and Engineering,Hainan University,Haikou 570228,China

Joint School of National University of Singapore and Tianjin University,International Campus of Tianjin University,Binhai New City,Fuzhou 350207,China

国家自然科学基金国家自然科学基金

5223100852001227

2024

材料科学技术(英文版)
中国金属学会 中国材料研究学会 中国科学院金属研究所

材料科学技术(英文版)

CSTPCD
影响因子:0.657
ISSN:1005-0302
年,卷(期):2024.169(2)
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