材料科学技术(英文版)2024,Vol.179Issue(12) :125-137.DOI:10.1016/j.jmst.2023.08.048

Simultaneously healing cracks and strengthening additively manufactured Co34Cr32Ni27Al4Ti3 high-entropy alloy by utilizing Fe-based metallic glasses as a glue

Hao Kang Kaikai Song Leilei Li Xiaoming Liu Yandong Jia Gang Wang Yaocen Wang Si Lan Xin Lin Lai-Chang Zhang Chongde Cao
材料科学技术(英文版)2024,Vol.179Issue(12) :125-137.DOI:10.1016/j.jmst.2023.08.048

Simultaneously healing cracks and strengthening additively manufactured Co34Cr32Ni27Al4Ti3 high-entropy alloy by utilizing Fe-based metallic glasses as a glue

Hao Kang 1Kaikai Song 2Leilei Li 1Xiaoming Liu 2Yandong Jia 3Gang Wang 3Yaocen Wang 1Si Lan 4Xin Lin 5Lai-Chang Zhang 6Chongde Cao7
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作者信息

  • 1. School of Physical Science and Technology,Northwestern Polytechnical University,Xian 710072,China
  • 2. School of Mechanical,Electrical & Information Engineering,Shandong University,Weihai 264209,China
  • 3. Institute of Materials,Shanghai University,Shanghai 200444,China
  • 4. Herbert Gleiter Institute of Nanoscience,School of Materials Science and Engineering,Nanjing University of Science and Technology,Nanjing 210094,China
  • 5. State Key Laboratory of Solidification Processing,Northwestern Polytechnical University,Xian 710072,China
  • 6. Centre for Advanced Materials and Manufacturing,School of Engineering,Edith Cowan University,270 Joondalup Drive,Joondalup,Perth,Western Australia 6027,Australia
  • 7. School of Physical Science and Technology,Northwestern Polytechnical University,Xian 710072,China;Research and Development Institute of Northwestern Polytechnical University in Shenzhen,Shenzhen 518057,China
  • 折叠

Abstract

Solidification cracking issues during additive manufacturing(AM)severely prevent the rapid development and broad application of this method.In this work,a representative Co34Cr32Ni27Al4Ti3 high-entropy al-loy(HEA)susceptible to crack formation was fabricated by selective laser melting(SLM).As expected,many macroscopic cracks appeared.The crack issues were successfully solved after introducing a certain amount of Fe-based metallic glass(MG)powder as a glue during SLM.The effect of MG addition on the formation and distribution of defects in the SLM-processed HEA was quantitatively investigated.With an increasing mass fraction of the MG,the dominant defects transformed from cracks to lack of fusion(LOF)defects and finally disappeared.Intriguingly,the MG preferred to be segregated to the boundaries of the molten pool.Moreover,the coarse columnar crystals gradually transformed into equiaxed crystals in the molten pool and fine-equiaxed crystals at the edge of the molten pool,inhibiting the initiation of cracks and providing extra grain boundary strengthening.Furthermore,multiple precipitates are formed at the boundaries of cellular structures,which contribute significantly to strengthening.Compared to the brit-tle SLM-processed Co34Cr32Ni27Al4Ti3 HEA,the SLM-processed HEA composite exhibited a high ultimate tensile strength greater than 1.4 Ga and enhanced elongation.This work demonstrates that adding Fe-based MG powders as glues into SLM-processed HEAs may be an attractive method to heal cracks and simultaneously enhance the mechanical properties of additively manufactured products.

Key words

Selective laser melting/High-entropy alloys/Crack healing/Metallic glasses/Mechanical properties

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基金项目

National Natural Science Foundation of China(51971180)

National Natural Science Foundation of China(51871132)

National Natural Science Foundation of China(51971179)

National Natural Science Foundation of China(52271037)

New R&D Institution Construction Program of Guangdong Province,China(2019B090905009)

Shenzhen Fundamental Research Program,China(JCYJ20210324122203010)

Shaanxi Provincial Science and Technology Program,China(2023-JC-ZD-23)

Foreign Senior Talents Program of Guangdong Province,China()

Fundamental Research Funds for the Central Universities of China(D5000230131)

出版年

2024
材料科学技术(英文版)
中国金属学会 中国材料研究学会 中国科学院金属研究所

材料科学技术(英文版)

CSTPCDCSCD
影响因子:0.657
ISSN:1005-0302
参考文献量65
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