首页|Constructing cell-membrane-mimic grain boundaries for high-performance n-type Ag2Se using high-dielectric-constant TiO2

Constructing cell-membrane-mimic grain boundaries for high-performance n-type Ag2Se using high-dielectric-constant TiO2

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The coupling of charge carrier and phonon transport limits the application of Ag2Se as a low-toxic near-room-temperature thermoelectric material.Strategies that reduce the thermal conductivity via enhanc-ing the phonon scattering usually lead to reduced carrier mobility due to high grain boundary potential barrier.In this study,we developed a cell-membrane-mimic grain boundary engineering strategy for de-coupling the charge carrier and phonon scattering through decorating high-dielectric-constant rutile TiO2 at Ag2Se grain boundaries to enable the charge carrier/phonon selective permeability.The nano-sized TiO2 with high dielectric permittivity can secure the charge carrier transport by shielding the interfacial Coulomb potential to lower the energy barrier of grain boundaries,rendering an enhanced power factor.Additionally,benefited from the enhanced phonon scattering by TiO2 nanoparticles,a significantly de-creased lattice thermal conductivity of～0.20 W m-1 K-1 and a high zT of～0.97 at 390 K are obtained in the Ag2Se-based nanocomposites.This work demonstrates that such cell-membrane-mimic grain bound-ary engineering strategy may shed light on developing high-performance thermoelectric materials.

ThermoelectricAg2SeGrain boundary decorationHigh-dielectric-constantTiO2

Yi-Yan Liao、Qiang Sun、Xu-Ping Jiang、Hao Wu、Bang-Zhou Tian、Ze-Gao Wang、Kun Zheng、Lei Yang

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School of Materials Science & Engineering,Sichuan University,Chengdu 610064,China

State Key Laboratory of Oral Diseases,National Clinical Research Center for Oral Diseases,West China Hospital of Stomatology,Sichuan University,Chengdu 610041,China

Sichuan Provincial Engineering Research Center of Oral Biomaterials,Sichuan University,Chengdu 610041,China

Department of Stomatology,the First Medical Centre,Chinese PLA General Hospital,Beijing 100853,China

Beijing Key Lab of Microstructure and Properties of Solids,Faculty of Materials and Manufacturing,Beijing University of Technology,Beijing 100124,China

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facilities,and the scientific and technical assistance of the Australian Microscopy & Microanalysis Research Facility at theNational Natural Science Foundation of ChinaNational Natural Science Foundation of ChinaNational Natural Science Foundation of ChinaSichuan Science and Technology ProgramFundamental Research Funds for the Central UniversitiesResearch Funding from West China School/Hospital of Stomatology Sichuan UniversityState Key Laboratory for Mechanical Behavior of Materialsfund of the State Key Laboratory of Solidification Processing in NPU

1207401552002254522721602023YFG0220YJ202242QDJF2022-220232509SKLSP202315

2024

10.1016/j.jmst.2023.08.049

材料科学技术(英文版)
中国金属学会 中国材料研究学会 中国科学院金属研究所

材料科学技术(英文版)

CSTPCD
影响因子：0.657
ISSN：1005-0302
年,卷(期)：2024.179(12)
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