首页|Tuning the growth of intermetallic compounds at Sn-0.7Cu solder/Cu substrate interface by adding small amounts of indium

Tuning the growth of intermetallic compounds at Sn-0.7Cu solder/Cu substrate interface by adding small amounts of indium

扫码查看
原文链接
  • NETL
  • NSTL
  • 万方数据
The void defect in intermetallic compounds(IMCs)layer at the joints caused by inhomogeneous atomic diffusion is one of the most important factors limiting the further development of Sn-based solders.In this work,the thermodynamic stability of IMCs(high-temperature η-Cu6Sn5 and o-Cu3Sn phases)was improved by adding small amounts of indium(In),and the IMCs layers with moderate thickness,low defect concentrations and stable interface bonding were successfully obtained.The formation order of compounds and the interfacial orientation relationships in IMCs layers,the atomic diffusion mechanism,and the growth tuning mechanism of In on η-Cu6Sn5 and Cu3Sn,after In adding,were discussed com-prehensively by combining calculations and experiments.It is the first time that the classic heteroge-neous nucleation theory and CALPHAD data were used to obtain the critical nucleus radius of η-Cu6Sn5 and Cu3Sn,and to explain in detail the main factors affecting the formation order and location of IMCs at joints during the welding process.A novel and systematic growth model about IMCs layers in the case of doping with alloying elements was proposed.The growth tuning mechanism of In doping on η-Cu6Sn5 and Cu3Sn was further clarified based on the proposed model using first-principles calculations.The growth model used in this study can provide insights into the development and design of multiele-ment Sn-based solders.

Sn-0.7Cu solderIMCsAgingAtomic migration barrierGrowth tuning

Ancang Yang、Yaoping Lu、Yonghua Duan、Mengnie Li、Shanju Zheng、Mingjun Peng

展开 >

Faculty of Material Science and Engineering,Kunming University of Science and Technology,Kunming 650093,China

College of Physics and Information Engineering,Fuzhou University,Fuzhou 350108,China

Innovation Team Cultivation Project of Yunnan ProvinceKey Research and Development Program of Yunnan ProvinceYunnan Ten Thousand Talents Plan Young& Elite Talents Project

202005AE160016202103AA080017YNWR-QNBJ-2018-044

2024

10.1016/j.jmst.2023.09.050

材料科学技术(英文版)
中国金属学会 中国材料研究学会 中国科学院金属研究所

材料科学技术(英文版)

CSTPCD
影响因子：0.657
ISSN：1005-0302
年,卷(期)：2024.182(15)
  • 56