首页|Studies on thermal stability,softening behavior and mechanism of an ADS copper alloy at elevated temperatures

Studies on thermal stability,softening behavior and mechanism of an ADS copper alloy at elevated temperatures

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An Al2O3 dispersion strengthened(ADS)alloy with an ultra-high softening temperature of~1200 K was fabricated by the in-situ internal oxidation and reduction methods.The evolution of the nanometer Al2O3 particles,grain size,and consequently the softening behavior of this ADS alloy,were investigated by con-ducting the annealing treatments in the range from 673 K to 1273 K for 60 min.These refined nanometer Al2O3 particles were found to be highly stable at elevated temperatures,leading to the high dislocation density and grain boundary stability of the matrix.The average grain size was found to increase extremely slowly from~0.60 μm to~0.74 μm with increasing annealing temperatures from 773 K to 1273 K.A cri-terion for grain boundaries migration and softening was established based on the competition between grain growth and pinning effect of Al2O3 particles.The strong pinning effect of Al2O3 particles was found when the grain size was between the lower limit(about 0.4-0.5 µm)and upper limit(2.18 µm).The occurrence of softening behavior was attributed to the rapid increase of the proportion of grains larger than the upper limit.A modified Hall-Petch relationship was established by introducing the integration of the grain size distribution,which can describe this correlation between softening behavior and the pinning effect of Al2O3 particles.The current study not only sheds light on the further understanding of the softening mechanism of ADS copper alloy but also provides a useful route for designing copper alloy with high softening resistance.

ADS copper alloyNanometer-scaled Al2O3 particlesGrain growthSoftening mechanismSoftening model

Feixiang Liu、Xinhua Liu、Guoliang Xie、Yuan Wu、Cunguang Chen

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Key Laboratory for Advanced Materials Processing(MOE),Institute for Advanced Materials and Technology,University of Science and Technology Beijing,Beijing 100083,China

Beijing Advanced Innovation Center for Materials Genome Engineering,Institute for Advanced Materials and Technology,University of Science and Technology Beijing,Beijing 100083,China

Beijing Laboratory of Metallic Materials and Processing for Modern Transportation,Institute for Advanced Materials and Technology,University of Science and Techno

State Key Laboratory for Advanced Metals and Materials,University of Science and Technology Beijing,Beijing 100083,China

Institute for Advanced Materials and Technology,University of Science and Technology Beijing,Beijing 100083,China

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National Key Research and Development Program of ChinaNational Natural Science Foundation of ChinaNational Natural Science Foundation of ChinaNatural Science Foundation for Distinguished Young Scholars of ChinaYouth Foundation of National Natural Science Foundation China

2020YFB031110192066205922663015192540152001020

2024

材料科学技术(英文版)
中国金属学会 中国材料研究学会 中国科学院金属研究所

材料科学技术(英文版)

CSTPCD
影响因子:0.657
ISSN:1005-0302
年,卷(期):2024.186(19)
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