首页|Advancing heat-tolerant composites with coherent ladder interfaces via constructing extremely fine nanolamellar solute-twining architectures

Advancing heat-tolerant composites with coherent ladder interfaces via constructing extremely fine nanolamellar solute-twining architectures

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The interface of ceramic particles and metal matrixes extremely impacts the mechanical properties of particle-reinforced metal matrix composites,especially at elevated temperatures.We provide a strat-egy for constructing extremely fine,in situ-formed coherent nanolamellar solute-twining architectures in a supersaturated MAX/Ni composite to modify the interface,aiming for higher strengths.Through this unique architecture,a coherent interface of ceramic particles and a metal matrix is formed,with an enormous coherent interface known as a ladder interface.The tensile strength at 1023 K is approxi-mately 1 GPa by forming a thermally stable Schwarz crystal structure(<3 nm).Developing heat-tolerant composites using this architecture may enhance the materials'available properties for high-temperature applications.

Modified coherent interfacesExtremely fine nanograins-nanotwinsNanolamellar architecturesThermal stabilityParticle-reinforced nickel matrix compositesMAX phases

Xue Li、Zhenying Huang、Hongjie Wang、Weici Zhuang、Min Zhang、Wenqiang Hu、Qun Yu、Youbo Wu、Yang Zhou

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Institute of Materials Science and Engineering,School of Mechanical and Electronic Control Engineering,Beijing Jiaotong University,Beijing 100044,China

Tangshan Research Institute of Beijing Jiaotong University,Tangshan 063000,China

Beijing Natural science FoundationNational Natural Science Foundation of ChinaNational Natural Science Foundation of ChinaResearch Fund for Commercialization of Major Scientific and Technological Achievements of Hebei ProvinceBeijing Government Funds for the Constructive Project of Central Universities.The financial supports by them are greatly app

2212046518710115157201722281006Z

2024

材料科学技术(英文版)
中国金属学会 中国材料研究学会 中国科学院金属研究所

材料科学技术(英文版)

CSTPCD
影响因子:0.657
ISSN:1005-0302
年,卷(期):2024.186(19)
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