Advanced high-entropy alloys breaking the property limits of current materials

Dongyue Li ¹Peter K.Liaw ²Lu Xie ¹Yong Zhang ³Wenrui Wang¹

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作者信息

1. School of Mechanical Engineering,University of Science and Technology Beijing,Beijing 100083,China
2. Department of Materials Science and Engineering,The University of Tennessee,Knoxville,TN 37996,USA
3. Beijing Advanced Innovation Center of Materials Genome Engineering,State Key Laboratory for Advanced Metals and Materials,University of Science and Technology Beijing,Beijing 100083,China
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Abstract

The growing need for stronger and more ductile structural materials has spurred an intense search for innovative,high-performance alloys.Traditionally,alloys face a pervasive trade-off:high strength often comes at the expense of ductility and vice versa.The advent of high-entropy alloys(HEAs)offering both high strength and ductility has transformed this landscape.In this work,we discuss the defor-mation mechanisms of HEAs,examine the foundations of the strength-ductility trade-off,and explore approaches for designing HEAs to surmount this limitation.Furthermore,we analyze the factors that govern HEA-deformation performance,which in turn influence the HEA design.We also propose a per-spective on future research directions concerning the mechanical behavior of HEAs,highlighting potential breakthroughs and novel strategies to advance the field.

Key words

High-entropy alloy/Strength-ductility/Trade-off/Microstructure/Deformation mechanism

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基金项目

National Natural Science Foundation of China(52101189)

National Natural Science Foundation of China(52273280)

National Key R&D Program of China(2020YFA0405700)

Chinese Postdoctoral Science Foundation(2020M680343)

Fundamental Research Funds for the Central Universities(FRF-TP-20-050A1)

National Science Foundation(DMR-1611180)

National Science Foundation(1809640)

National Science Foundation(2226508)

Army Research Office(W911NF-13-1-0438)

Army Research Office(W911NF-19-2-0049)

出版年

2024

材料科学技术(英文版)

中国金属学会中国材料研究学会中国科学院金属研究所

材料科学技术(英文版)

CSTPCD

影响因子：0.657

ISSN：1005-0302

参考文献量191

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