首页|In situ TEM study of pulse-enhanced plasticity of monatomic metallic glasses

In situ TEM study of pulse-enhanced plasticity of monatomic metallic glasses

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The electropulsing process can be used to tailor the microstructure and deformability of metallic glasses(MGs).Here,we report the microstructural origin of enhanced electroplasticity of monatomic Ta MG nanowires.Under electromechanical loading,the Ta MG nanowire exhibits improved ductility and ob-vious necking behavior.By evaluating the dynamic structural evolution via in situ diffraction,it is found that the atomic mobility in flow units of Ta MG can be improved significantly under the stimulation of pulse current,mainly through the athermal electron-atom interaction,which results in the fast annihila-tion of flow units and,thereby,fast structural relaxation.These structural evolution processes can help to eliminate the formation of the obvious shear band.These findings provide insight into the origin of elec-troplasticity in amorphous materials,which is of scientific and technological significance for the design and processing of a variety of MGs.

Metallic glassNanowireElectromechanical loadingFlow unitsElectroplasticityElectrical pulse

Xing Li、Youran Hong、Haibo Ke、Li Zhong、Yu Zou、Jiangwei Wang

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Center of Electron Microscopy,State Key Laboratory of Silicon and Advanced Semiconductor Materials,School of Materials Science and Engineering,Zhejiang University,Hangzhou 310027,China

Wenzhou Key Laboratory of Novel Optoelectronic and Nano Materials,Institute of Wenzhou,Zhejiang University,Wenzhou 325006,China

Songshan Lake Materials Laboratory,Dongguan 523808,China

SEU-FEI Nano-Pico Center,Key Laboratory of MEMS of Ministry of Education,Southeast University,Nanjing 210096,China

Department of Materials Science and Engineering,University of Toronto,Toronto,Ontario M5S 3E4,Canada

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open research fund of Songshan Lake Materials LaboratoryNational Natural Science Foundation of ChinaZhejiang Provincial Natural Science Foundation of ChinaZhejiang University Global Partnership Fund

2021SLABFN1552071284LR24E010002

2024

10.1016/j.jmst.2023.12.068

材料科学技术(英文版)
中国金属学会 中国材料研究学会 中国科学院金属研究所

材料科学技术(英文版)

CSTPCD
影响因子：0.657
ISSN：1005-0302
年,卷(期)：2024.195(28)