首页|Enhanced interfacial bonding of AF/PEEK composite based on CNT/aramid nanofiber multiscale flexible-rigid structure

Enhanced interfacial bonding of AF/PEEK composite based on CNT/aramid nanofiber multiscale flexible-rigid structure

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The application of aramid fiber(AF)/polyetheretherketone(PEEK)composites is currently hindered by the inert surface and poor wettability of AF,resulting in weak interfacial adhesion and poor mechani-cal properties.Surface coating and the introduction of nanostructures have been proven to be effective approaches to address this problem.Herein,a simple hybrid sizing agent has been developed to modify the AF surface,consisting of soluble polyimide(PI)as a compatibilizer,carboxyl-functionalized carbon nanotubes(CNT-COOH)as a rigid unit,and aramid nanofibers(ANF)as a flexible component.The syner-getic effects of Pl and the multiscale flexible-rigid structure(CNT-COOH/ANF)contribute to the formation of chemical and physical bonds between AF and PEEK matrix,further improving the interfacial adhesion and stress transfer efficiency.Attributed to the enhanced wettability and roughness of AF,compared with unsized AF,the flexural strength(220.97 MPa),modulus(13.26 GPa),ILSS(13.36 MPa),and storage modu-lus(12.93 GPa)of the AF/PEEK composite increase by 132.60%,99.00%,18.97%,and 82.70%respectively.Additionally,the flexible-rigid nanonetwork facilitates the penetration of the PEEK resin into pore spaces.This simple and effective approach exhibits promising potential in enhancing the interfacial bonding of AF/PEEK composites.

Aramid fiber(AF)/polyetheretherketone(PEEK)Matrimid 5218(PI)Aramid nanofibersCarbon nanotubesInterfacial adhesion

Nan Zhou、Long Xia、Naiyu Jiang、Yingze Li、Hanxiong Lyu、Hongyan Zhang、Xiaohu Zou、Wenbo Liu、Dongxing Zhang

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School of Materials Science and Engineering,Harbin Institute of Technology,Harbin 150001,China

School of Materials Science and Engineering,Harbin Institute of Technology at Weihai,Weihai 264209,China

Department of Civil and Environmental Engineering,Hong Kong Polytechnic University,999077,Hong Kong,China

Hongshan Information Technology Research Institute,Beijing 102600,China

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2024

材料科学技术(英文版)
中国金属学会 中国材料研究学会 中国科学院金属研究所

材料科学技术(英文版)

CSTPCD
影响因子:0.657
ISSN:1005-0302
年,卷(期):2024.197(30)