首页|Structure,properties and applications of multi-functional thermally conductive polymer composites

Structure,properties and applications of multi-functional thermally conductive polymer composites

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This study provides a concise overview of the latest developments in multifunctional thermally conduc-tive polymer composites(TCPCs).Drawing from the current state of research,the study elucidates the mechanisms that underpin thermal conductivity in polymers and their composites.It further delineates the structure-property relationships of TCPCs,focusing on their modulus,resilience,and orientation.Con-currently,this work delves into the principles and structural design of TCPCs endowed with self-healing capabilities,electromagnetic interference(EMI)shielding,and electrical insulation characteristics.In par-ticular,it outlines design strategies for imparting self-healing features to TCPCs and explores the inter-play between thermal conductivity and self-healing efficacy.The principles of EMI shielding are clarified,along with the primary structural variants of TCPCs possessing EMI shielding attributes.Additionally,the paper addresses the insulative treatments applied to fillers within composites to enhance their electrical insulation.It concludes with a brief exposition of applications spanning electronic packaging,batteries,aerospace,LEDs,and flexible&stretchable electronics,to sensors.The aim of this review is to provide fresh insights for researchers intent on devising TCPCs with integrated self-healing,electromagnetic shielding,and electrical insulation functionalities,and to articulate strategies for optimizing the thermal conductiv-ity coefficient(λ)alongside these attributes.

Thermal conductivityPolymerStructureSelf-healingElectromagnetic interference shieldingElectrical insulationApplication

Yali Dong、Huitao Yu、Yiyu Feng、Wei Feng

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School of Materials Science and Engineering and Tianjin Key Laboratory of Composite and Functional Materials,Tianjin University,Tianjin 300350,China

2024

材料科学技术(英文版)
中国金属学会 中国材料研究学会 中国科学院金属研究所

材料科学技术(英文版)

CSTPCD
影响因子:0.657
ISSN:1005-0302
年,卷(期):2024.200(33)