材料科学技术(英文版)2024,Vol.200Issue(33) :141-161.DOI:10.1016/j.jmst.2024.02.070

Structure,properties and applications of multi-functional thermally conductive polymer composites

Yali Dong Huitao Yu Yiyu Feng Wei Feng
材料科学技术(英文版)2024,Vol.200Issue(33) :141-161.DOI:10.1016/j.jmst.2024.02.070

Structure,properties and applications of multi-functional thermally conductive polymer composites

Yali Dong 1Huitao Yu 1Yiyu Feng 1Wei Feng1
扫码查看

作者信息

  • 1. School of Materials Science and Engineering and Tianjin Key Laboratory of Composite and Functional Materials,Tianjin University,Tianjin 300350,China
  • 折叠

Abstract

This study provides a concise overview of the latest developments in multifunctional thermally conduc-tive polymer composites(TCPCs).Drawing from the current state of research,the study elucidates the mechanisms that underpin thermal conductivity in polymers and their composites.It further delineates the structure-property relationships of TCPCs,focusing on their modulus,resilience,and orientation.Con-currently,this work delves into the principles and structural design of TCPCs endowed with self-healing capabilities,electromagnetic interference(EMI)shielding,and electrical insulation characteristics.In par-ticular,it outlines design strategies for imparting self-healing features to TCPCs and explores the inter-play between thermal conductivity and self-healing efficacy.The principles of EMI shielding are clarified,along with the primary structural variants of TCPCs possessing EMI shielding attributes.Additionally,the paper addresses the insulative treatments applied to fillers within composites to enhance their electrical insulation.It concludes with a brief exposition of applications spanning electronic packaging,batteries,aerospace,LEDs,and flexible&stretchable electronics,to sensors.The aim of this review is to provide fresh insights for researchers intent on devising TCPCs with integrated self-healing,electromagnetic shielding,and electrical insulation functionalities,and to articulate strategies for optimizing the thermal conductiv-ity coefficient(λ)alongside these attributes.

Key words

Thermal conductivity/Polymer/Structure/Self-healing/Electromagnetic interference shielding/Electrical insulation/Application

引用本文复制引用

出版年

2024
材料科学技术(英文版)
中国金属学会 中国材料研究学会 中国科学院金属研究所

材料科学技术(英文版)

CSTPCD
影响因子:0.657
ISSN:1005-0302
段落导航相关论文