首页|Understanding the formation mechanism of SiC/Al joints by U-TLP bonding with the inactive Zn interlayer
Understanding the formation mechanism of SiC/Al joints by U-TLP bonding with the inactive Zn interlayer
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The ultrasonic-assisted transient liquid phase(U-TLP)bonding process is extremely fast,which is a great challenge to reveal the inherent mechanisms.Understanding the joint formation mechanism of U-TLP is essential for the joining process design.In this study,the SiC ceramics and 6063Al alloys were joined by U-TLP using a Zn interlayer.The process of removing the oxide film on the base metal involved crack-ing,flaking off,suspending,and fragmenting.The migration of the eutectic liquid phases frontier was very fast(within 1 s).The relationship between the thickness of the liquid layer and the ultrasonic ac-tion time was a power function.The typical microstructure of the SiC/6063AI joints was SiC/amorphous Al2O3/Zn-Al eutectic/Zn-Al eutectoid/6063Al.The shear strength of SiC/6063Al joints increased with the interfacial bonding ratio and reached up to 27 MPa for the ultrasonic action time of 5 s.The metallurgical bonding at the SiC/bond metal interface was formed through the amorphous Al2O3 transition layer.The formation mechanism of the Al2O3 reaction layer was revealed based on the thermodynamics,kinetics,and acoustics cavitation theory.This will provide a guideline for the future U-TLP process design.
SiC ceramicU-TLPInterfacial reactionAcoustics cavitationThermodynamics
Di Zhao、Chenchen Zhao、Ziyang Xiu、Jiuchun Yan
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State Key Laboratory of Advanced Welding and Joining,Harbin Institute of Technology,Harbin 150001,China
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