首页|β-In2Se3堆垛缺陷的电子显微学研究

β-In2Se3堆垛缺陷的电子显微学研究

扫码查看
基于像差校正扫描透射电子显微学和第一性原理计算,研究了 vanderWaals(范德瓦尔斯)层状β-In2Se3中堆垛缺陷的原子构型.结果表明,在2Hβ-In2Se3中存在大量的置换型层错(RSF)和滑移型层错(SSF),发现了一种在热力学上易自发形成的T相滑移型堆垛层错(tSSF);在3Rβ-In2Se3中只观察到一种能量较高的滑移型层错;2H和3Rβ-In2Se3以界面连续过渡的方式发生相分离.本文还构建9种β-In2Se3潜在的堆垛层错构型,并计算了相应的堆垛层错能并从能量角度分析了堆垛层错的成因.最后,指出建立分类术语描述类vanderWaals层状材料堆垛层错的必要性.
Electron Microscopy Study of Stacking Defects in β-In2Se3
In2Se3 has recently received much attention because of its excellent ferroelectric,thermo-electric,and photoelectric properties.However,the stacking defects,known as an important factor affect-ing the properties of van der Waals layered materials,have not yet been explored for In2Se3.Herein,the atomic configurations of stacking defects in van der Waals layered β-In2Se3 were studied by means of ab-erration-corrected scanning transmission electron microscopy combined with first-principles calculations.There are a significant amount of replacement-type stacking faults(RSFs)and slip-type stacking faults(SSFs)in 2H β-In2Se3.Moreover,the 1T phase slip-type stacking fault(tSSF),which is thermodynamically prone to spontaneous formation,was observed in 2H β-In2Se3.However,only the SSF was observed as a high energy configuration in 3R β-In2Se3.The phase separation occurred between 2H and 3R β-In2Se3with a coherent stacking interface.In addition,nine potential stacking fault configurations ofβ-In2Se3 were con-structed,the corresponding stacking fault energies were calculated,and the causes of stacking faults were analyzed from an energetic perspective.Finally,the need for a classification term describing the stacking faults in van der Waals-like layered materials is pointed out.

inorganic nonmetallic materialsstacking faultβ-In2Se3HAADF-STEMfirst-principles calculations

王强、朱鹤雨、刘志博、朱毅、刘培涛、任文才

展开 >

沈阳化工大学材料科学与工程学院 沈阳 110142

中国科学院金属研究所沈阳材料科学国家研究中心 沈阳 110016

中国科学技术大学材料科学与工程学院 沈阳 110016

无机非金属材料 堆垛层错 β-In2Se3 HAADF-STEM 第一性原理计算

国家自然科学基金中国科学院青年创新促进会沈阳材料科学国家研究中心青年人才项目

5227205020210001852019000191

2024

材料研究学报
国家自然科学基金委员会 中国材料研究学会

材料研究学报

CSTPCD北大核心
影响因子:0.605
ISSN:1005-3093
年,卷(期):2024.38(5)
  • 1