SiC陶瓷的磨削去除机理及参数对磨削力影响
Removal Mechanism and Effect of Parameters on Grinding Force in Grinding SiC Ceramics
周云光 1田川川 2王书海 2陈晗2
作者信息
- 1. 东北大学 机械工程与自动化学院,辽宁 沈阳 110819;中航沈飞民用飞机有限责任公司,辽宁 沈阳 110850;秦皇岛瑞方机械有限公司,河北 秦皇岛 066000
- 2. 东北大学 机械工程与自动化学院,辽宁 沈阳 110819
- 折叠
摘要
为探究SiC陶瓷的磨削去除机理及磨削参数对磨削力影响规律,基于SPH(smoothed particle hydrodynamics)法建立了单磨粒冲击SiC陶瓷仿真模型,分析了SiC磨削裂纹产生和扩展机制;通过单因素试验分析了vs,vw和ap对SiC磨削去除机理、法向磨削力和切向磨削力的影响规律.结果表明,磨粒冲击导致中位裂纹和横向裂纹产生,随着磨粒压入深度的增加,横向裂纹向材料近表面区域扩展,当横向裂纹扩展至材料表面形成脆性断裂;随着vs的增大,vw和ap的减小,磨削表面产生的凹坑区域和凹坑深度减小,塑性去除区域变大,法向磨削力和切向磨削力均呈减小趋势.研究成果为SiC构件的高效低损伤加工提供重要依据.
Abstract
In order to explore the removal mechanism and influence law of grinding force in grinding SiC ceramics,the simulation model of single abrasive striking SiC ceramics was established based on the SPH(smoothed particle hydrodynamics)method,and the crack generation and propagation mechanism during grinding SiC ceramics were analyzed;the effect of grinding velocity(vs),feeding rate(vw)and grinding depth(ap)on the removal mechanism,the normal grinding force and tangential grinding force of grinding SiC ceramics were analyzed by the single factor experiment.The results showed that the abrasives striking the workpiece lead to the generation of the median cracks and the transverse cracks.With the increase of abrasive pressing depth,the transverse crack expands to the material surface,and when the transverse crack expands to the material surface,the brittle fracture occurs.With the increase of vs,the decrease of vw and ap,and the decrease of the area and depth of the pits on the grinding surface,the plastic removal area becomes larger,and the normal grinding force and tangential grinding force both decrease.These results may provide an important basis for high-efficiency and low-damage machining of SiC ceramic components.
关键词
磨削/去除机理/磨削力/SiC陶瓷/SPHKey words
grinding/removal mechanism/grinding force/SiC ceramics/SPH引用本文复制引用
基金项目
国家自然科学基金(51905083)
国家自然科学基金(51975113)
河北省自然科学基金(E2022501004)
中央高校基本科研业务费专项(N2123025)
中央高校基本科研业务费专项(N2203015)
中国博士后科学基金(2021MD703912)
出版年
2024
NETL
NSTL
万方数据