SiCp粒径级配对55％SiCp/6061AI复合材料组织和性能的影响

Effect of SiCp Particle Size Grading on the Microstructure and Properties of 55％SiCp/6061Al Composites

王梦奇 ¹刘越 ²肖春林 ³刘春明¹

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作者信息

1. 东北大学材料科学与工程学院,辽宁沈阳 110819;东北大学材料各向异性与织构教育部重点实验室,辽宁沈阳 110819
2. 东北大学材料科学与工程学院,辽宁沈阳 110819
3. 辽宁蓝煜新材料有限公司,辽宁铁岭 112606
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摘要

采用真空热压法制备了55％SiCp/6061Al(55％为体积分数)复合材料,研究SiCp粒径级配对复合材料SiCp分布均匀度、致密度和抗弯强度的影响.研究结果表明:粒径级配复合材料组织致密、SiCp分布均匀且SiCp与6061Al合金基体界面结合强度高.双粒径(60+25)μm、质量比4∶1复合材料热处理后抗弯强度由395 MPa提高为548 MPa;三粒径级配为(120+60+25)μm、质量比为1∶1∶1的复合材料热处理前抗弯强度最高,为397 MPa;双粒径级配(106+25)μm、质量比4∶1的复合材料致密度>99.0％、均匀度>90.00％、热处理后抗弯强度>400MPa,具有优异的综合性能.

Abstract

55％SiCp/6061Al (55％ is volume fraction) composites were prepared using the vacuum hot pressing method. The effects of SiCp particle size on distribution uniformity,density and bending strength of the composites were investigated. The results showed that composites with particle size grading have a dense microstructure,uniform SiCp distribution and high interfacial bonding strength between SiCp and the 6061Al alloy matrix. The bending strength of (60+25) μm composite with a mass ratio of 4∶1 raises from 395 MPa to 548 MPa. The bending strength of (120+60+25) μm composite with a mass ratio of 1∶1∶1 is the highest,reaching 397 MPa. The double grain size grading (106+25) μm composite with a mass ratio 4∶1 exhibits excellent comprehensive properties,with density>99.00％,uniformity>90.00％ and bending strength>400 MPa after heat treatment.

关键词

55％SiCp/6061Al复合材料/真空热压/粒径级配/均匀度/致密度/抗弯强度

Key words

55％SiCp/6061Al composite/vacuum hot pressing/grain size grading/uniformity/density/bending strength

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出版年

2024

东北大学学报(自然科学版)

东北大学

东北大学学报(自然科学版)

CSTPCDCSCD北大核心

影响因子：0.507

ISSN：1005-3026

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