首页|蚀刻补偿工艺在阶梯线路上的应用

蚀刻补偿工艺在阶梯线路上的应用

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本文提出了一种在板面厚度为15 μm/30 μm的阶梯板上制作线路宽度为75 μm的阶梯线路的新型工艺——蚀刻补偿工艺.首先选用板面厚度为15μm的双面覆铜板制作板面厚度为15μm/30 μm阶梯板,进而利用蚀刻补偿工艺在此阶梯板上制作线路宽度为75μm阶梯线路,最后再通过线宽、线路形貌以及蚀刻因子对所制作的阶梯线路进行评价.结果表明,该工艺简单、可靠,可广泛应用于阶梯线路制作.
Application of Etching Compensation on Ladder Circuit
A new etching compensation technology was proposed to the fabricate ladder circuit with linewidth of 75 μm on the ladder copper-clad laminates with thickness of 15 μm/30 μm.Double-sided copper-clad laminates with thickness of 15 μm were firstly used to produce ladder laminates.Then etching compensation technology was used to make 75 μm linewidth ladder circuit.Finally,the produced ladder circuits were evaluated by line width,line morphology and etching factor.The results showed that this technology was simple,reliable and could be widely used in the manufacture of ladder circuit.

ladder copper-clad laminatesladder circuitetching compensation

李晓蔚

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西安工程大学实验室管理处,西安710048

阶梯板 阶梯线路 蚀刻补偿

2018

电镀与精饰
天津市电镀工程学会

电镀与精饰

CSTPCD北大核心
影响因子:0.522
ISSN:1001-3849
年,卷(期):2018.40(5)
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