首页|电解铜箔添加剂的研究进展

电解铜箔添加剂的研究进展

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随着我国电子信息产业的迅速发展,电子产品对电解铜箔的生产工艺要求越来越高,如电解铜箔的性能影响着锂电池的使用寿命和电池容量.电解铜箔制备工艺中,添加剂的种类和含量是决定其性能优劣的重要因素.添加剂的引入可以改变阴极铜电沉积反应电位,影响镀铜层的表面形貌和微观织构,合理使用多种添加剂可以提升铜箔的综合性能.根据添加剂作用机理分类,以特征官能团为切入点,综述了氯离子、加速剂、整平剂和抑制剂在铜沉积过程中的作用,并对不同添加剂之间的相互作用机理及相互作用效果进行了归纳.通过了解添加剂的作用机理、添加剂之间的相互作用,在理论上可以研究添加剂机理与铜箔性能的关联性,解释添加剂机理与铜箔性能的矛盾;在生产上可以优化添加剂组合配方,有效控制电解铜箔性能,为实际生产提高生产效率和节约成本.
Research progress of electrolytic copper foil additives
With the rapid development of China's electronic information industry,the production process of electrolytic copper foil for electronic products has become increasingly demanding,as the performance of electrolytic copper foil affects the lifespan and capacity of lithium batteries.In the preparation process of electrolytic copper foil,the type and content of additives are the crucial factors determining its performance.The introduction of additives can change the deposition reaction potential of cathodic copper,affect the surface morphology and microstructure of the copper plating layer,and the rational use of multiple additives can improve the comprehensive performance of copper foil.Based on the classification of the action mechanism of additives and using characteristic functional groups as a starting point,this article reviews the roles of chloride ions,accelerators,leveling agents and suppres-sors in the copper deposition process,and summarizes the interaction mechanisms and effects among different additives.By understanding the action mechanism of additives and their interactions,it is possible to study the correlation between the additive mechanism and the performance of copper foil in theory,and explain the contradictions between the additive mechanism and the performance of copper foil.In production,the combination of additives can be optimized to effectively control the performance of electrolytic copper foil,improve production efficiency and save costs.

electrolytic copper foilpropertiesadditivesaction mechanismeffectsinteraction

代超熠、唐先忠、何为、皮亦鸣、苏元章、唐耀、陈苑明

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电子科技大学 材料与能源学院,四川 成都 611731

珠海方正科技高密电子有限公司&珠海方正科技多层电路板有限公司,广东 珠海 519175

电子科技大学 广东电子信息工程研究院,广东 东莞 523808

电解铜箔 性能 添加剂 作用机理 效果 相互作用

国家自然科学基金项目珠海市创新团队项目珠海市产学研合作项目

61974020ZH0405190005PWC2220004002990

2024

电镀与精饰
天津市电镀工程学会

电镀与精饰

CSTPCD北大核心
影响因子:0.522
ISSN:1001-3849
年,卷(期):2024.46(2)
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