首页|丁二酰亚胺对低共熔溶剂中银成核机理的影响

丁二酰亚胺对低共熔溶剂中银成核机理的影响

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本文采用循环伏安法(CV)和计时电流法(CA)考察了在有无丁二酰亚胺添加的条件下低共熔溶剂(DESs)中银的结晶成核机理;利用扫描电子显微镜(SEM)和X射线衍射仪(XRD)观察镀液浓度变化对镀层微观形貌以及相组成的影响.计时电流的结果表明,丁二酰亚胺的加入使Ag的结晶方式发生改变,Ag在DESs-0.6 mol/L丁二酰亚胺和0.1 mol/L AgNO3中电结晶过程是受扩散控制的三维连续成核.随着丁二酰亚胺的加入,镀层表面Ag结晶更加细致,结晶度增大,并且银镀层耐腐蚀性能得到提高.
Effect of succinimide on the nucleation mechanism of silver in deep eutectic solvents
Cyclic voltammetry(CV)and chronoamperometry(CA)were used to investigate the nucle-ation mechanism of silver in deep eutectic solvents(DESs)with or without the addition of succinimide.Scanning electron microscopy(SEM)and X-ray diffraction(XRD)were applied to observe the effect of plating solution concentration on the microstructure and phase composition of the coating.The results of chronoamperometry showed that the addition of succinimide changed the crystallization mode of Ag,and the process of Ag crystallization in DES-0.6 mol/L succinimide and 0.1 mol/L AgNO3 was three-dimensional continuous nucleation controlled by diffusion.With the addition of succinimide,the surface Ag crystallization of the coating becomes finer,the crystallinity increases,and the corrosion resistance of the silver coating are improved.

deep eutectic solventssilver coatingelectrodeposition behaviorsuccinimide

徐铭孝、战充波、张司琪、毕铭雪、孙海静、韩力、孙杰

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沈阳理工大学 环境与化学工程学院,辽宁 沈阳 110159

新东北电气集团高压开关有限公司,辽宁 沈阳 110027

低共熔溶剂 银镀层 电沉积行为 丁二酰亚胺

沈阳理工大学高水平成果建设项目沈阳理工大学科研创新团队支持项目&&

SYLUXM202105SYLUTD202004LJKMZ20220598

2024

电镀与精饰
天津市电镀工程学会

电镀与精饰

CSTPCD北大核心
影响因子:0.522
ISSN:1001-3849
年,卷(期):2024.46(3)
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