粗化工艺对电解铜箔抗剥离强度和劣化率的影响
The influence of coarsening process on the anti-peeling strength and degradation rate of electrolytic copper foil
彭雪嵩 1由宏伟 1李兰晨 1宋姝嬛 1乐士儒 1张锦秋 1杨培霞 1安茂忠1
作者信息
- 1. 哈尔滨工业大学 化工与化学学院,黑龙江 哈尔滨 150000
- 折叠
摘要
铜箔粗化工艺与固化工艺是铜箔表面后处理中最关键的两个环节,粗化与固化工艺的好坏直接决定铜箔的性能.根据铜箔粗化与固化工艺过程,本文研究了Cu2+浓度、电流密度、镀液温度等因素对铜箔表面形貌和抗剥离性能以及劣化率的影响,在优化后的工艺条件下制备出了抗剥离强度为1.29 N/mm,劣化率为3.01%且无侧蚀的粗化电解铜箔.
Abstract
The coarsening and curing processes of copper foil are the two most crucial steps in the surface post-treatment of copper foil,and the quality of the coarsening and curing processes directly determines the performance of copper foil.Based on the coarsening and solidification process of copper foil,this article studied the effects of Cu2+ concentration,current density and bath temperature on the surface morphology,anti-peeling strength and degradation rate of copper foil were studied.Under optimized process conditions,a coarsening electrolytic copper foil with a anti-peeling strength of 1.29 N/mm,a degradation rate of 3.01%,and no side corrosion was prepared.
关键词
电解铜箔/粗化工艺/抗剥离强度/劣化率/粗糙度Key words
electrolytic copper foil/coarsening process/anti-peeling strength/degradation rate/rough-ness引用本文复制引用
基金项目
国家重点研发项目(2021YFB3400801)
出版年
2024
NETL
NSTL
万方数据