Ethylene glycol (EG) and ethylene glycol-ionic liquids (EG-ILs) have found extensive ap-plications as electrolytes in electrodeposition. A comprehensive overview of semiconductor materials, thermoelectric materials, and elemental metals electrodeposited in the EG system reveals EG's effective-ness as an organic solvent due to its high boiling point, making it suitable for electrodeposition across a broad temperature range. The evolution of electrodeposition temperatures from high to ambient tempera-tures and the ability to finely control coating properties through additives and process parameters are no-table aspects. In the EG-ILs system, a summary of electrodeposited magnetic materials, corrosion-resis-tant materials, and catalytic materials demonstrates that coatings obtained in EG-ILs exhibit outstanding corrosion resistance and catalytic performance. This review also delves into the electrodeposition mecha-nism of metals in EG plating solutions.
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